220 Series

Catalog

IC & COMPONENT SOCKET, 20 CONTACTS, SIP SOCKET, 2.54 MM, 220 SERIES, 3.66 MM, BERYLLIUM COPPER

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Mating	Contact Finish - Post	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Material - Post	Termination	Type	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Termination Post Length	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert From (Adapter End) [custom]	Convert From (Adapter End) [custom]	Convert From (Adapter End)
3M Electronic Specialty 220-2600-00-0602	1 A	UL94 V-0	3.3 mm	0.13 in	Beryllium Copper	Gold	Gold	-55 C	125 °C	0.1 in	2.54 mm	0.1 "	2.54 mm	Polysulfone (PSU) Glass Filled	30 µin	0.76 µm	20	Beryllium Copper	Solder	SIP ZIF (ZIP)	Through Hole
3M Electronic Specialty 220-2600-50-0602	1 A	UL94 V-0	3.3 mm	0.13 in	Beryllium Copper	Gold	Gold	-55 C	125 °C	0.1 in	2.54 mm	0.1 "	2.54 mm	Polysulfone (PSU) Glass Filled	30 µin	0.76 µm	20	Beryllium Copper	Solder	SIP ZIF (ZIP)	Through Hole
3M Electronic Specialty 220-3342-19-0602J	1 A	UL94 V-0	0.62 in		Beryllium Copper	Gold	Gold	-55 C	125 °C	0.1 in	2.54 mm	0.1 "	2.54 mm	Polysulfone (PSU) Glass Filled	30 µin	0.76 µm		Beryllium Copper	Wire Wrap		Through Hole	0.76 Ám	30 Áin	Closed Frame	15.75 mm	7.62 mm	DIP	0.3 in	0.3 in	7.62 mm	DIP
3M Electronic Specialty 220-7201-55-1902	1 A	UL94 V-0	3.56 mm	0.14 in	Beryllium Copper	Gold	Gold	-55 C	150 °C					Polyethersulfone (PES) Glass Filled	30 µin	0.76 µm	20	Beryllium Copper	Solder	SOIC	Through Hole			Closed Frame