170673 Series
Manufacturer: Molex
Beta
⌘K
EDGELINE VERTICAL CONNECTOR, 12.5 GBPS, 0.80MM PITCH, 1.57MM PCB THICKNESS, 2 BAYS, 108 CIRCUITS
| Part | Material - Insulation | Card Type | Gender | Mounting Type | Color | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions | Termination | Pitch | Pitch | Read Out | Number of Rows [custom] | Contact Material | Contact Finish | Contact Finish Thickness | Contact Finish Thickness | Number of Positions/Bay/Row [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Molex | Thermoplastic Glass Filled | Non Specified - Dual Edge | Female | Through Hole | Black | -40 C | 105 ░C | 108 | Press-Fit | 0.8 mm | 0.031 in | Dual | 2 | Copper Alloy | Gold | 30 Áin | 0.76 Ám | |
 Molex | Thermoplastic Glass Filled | Non Specified - Dual Edge | Female | Through Hole | Black | -40 C | 105 ░C | 46 | Press-Fit | 0.8 mm | 0.031 in | Dual | 2 | Copper Alloy | Gold | 30 Áin | 0.76 Ám | |
 Molex | Non Specified - Dual Edge | Female | Through Hole | Black | -40 C | 105 ░C | 200 | Press-Fit | 0.8 mm | 0.031 in | Dual | 2 | Copper Alloy | Gold | 30 Áin | 0.76 Ám | 100 | |
 Molex | Thermoplastic Glass Filled | Non Specified - Dual Edge | Female | Through Hole | Black | -40 C | 105 ░C | 278 | Press-Fit | 0.8 mm | 0.031 in | Dual | 2 | Copper Alloy | Gold | 30 Áin | 0.76 Ám | |
 Molex | Thermoplastic Glass Filled | Non Specified - Dual Edge | Female | Through Hole | Black | -40 C | 105 ░C | 80 | Press-Fit | 0.8 mm | 0.031 in | Dual | 2 | Copper Alloy | Gold | 30 Áin | 0.76 Ám |