170673 Series
Manufacturer: Molex
Beta
⌘K
EDGELINE VERTICAL CONNECTOR, 12.5 GBPS, 0.80MM PITCH, 1.57MM PCB THICKNESS, 2 BAYS, 108 CIRCUITS
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Contact Finish | Read Out | Card Type | Pitch [x] | Pitch [x] | Number of Rows | Mounting Type | Material - Insulation | Gender | Contact Finish Thickness | Contact Finish Thickness | Color | Contact Material | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Molex | -40 °C | 105 ░C | Press-Fit | Gold | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 2 | Through Hole | Thermoplastic Glass Filled | Female | 0.76 Ám | 30 Áin | Black | Copper Alloy | 108 |
 Molex | -40 °C | 105 ░C | Press-Fit | Gold | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 2 | Through Hole | Thermoplastic Glass Filled | Female | 0.76 Ám | 30 Áin | Black | Copper Alloy | 46 |
 Molex | -40 °C | 105 ░C | Press-Fit | Gold | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 2 | Through Hole | Thermoplastic Glass Filled | Female | 0.76 Ám | 30 Áin | Black | Copper Alloy | 278 |
 Molex | -40 °C | 105 ░C | Press-Fit | Gold | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 2 | Through Hole | Thermoplastic Glass Filled | Female | 0.76 Ám | 30 Áin | Black | Copper Alloy | 80 |