SIP1X02 Series

Catalog

CONN SOCKET SIP 2POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Type	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post [custom]	Housing Material	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Contact Finish - Mating	Termination
Amphenol ICC (FCI) SIP1X02-001BLF	UL94 V-0	0.125 in	3.18 mm	0.1 in	2.54 mm	SIP	0.1 "	2.54 mm	Tin	200 µin	5.08 µm	Brass	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.76 Ám	30 Áin	Closed Frame	Through Hole	1 x 2	2	Gold	Solder
Amphenol ICC (FCI) SIP1X02-041BLF	UL94 V-0	0.125 in	3.18 mm	0.1 in	2.54 mm	SIP	0.1 "	2.54 mm	Tin	200 µin	5.08 µm	Brass	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.76 Ám	30 Áin	Closed Frame	Through Hole	1 x 2	2	Gold	Solder
Amphenol ICC (FCI) SIP1X02-011BLF	UL94 V-0	0.125 in	3.18 mm	0.1 in	2.54 mm	SIP	0.1 "	2.54 mm	Tin	200 µin	5.08 µm	Brass	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.25 µm	10 µin	Closed Frame	Through Hole	1 x 2	2	Gold	Solder
Amphenol ICC (FCI) SIP1X02-001B	UL94 V-0	0.125 in	3.18 mm	0.1 in	2.54 mm	SIP	0.1 "	2.54 mm	Tin-Lead	200 µin	5.08 µm	Brass	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.76 Ám	30 Áin	Closed Frame	Through Hole	1 x 2	2	Gold	Solder
Amphenol ICC (FCI) SIP1X02-011B	UL94 V-0	0.125 in	3.18 mm	0.1 in	2.54 mm	SIP	0.1 "	2.54 mm	Tin-Lead	200 µin	5.08 µm	Brass	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.25 µm	10 µin	Closed Frame	Through Hole	1 x 2	2	Gold	Solder
Amphenol ICC (FCI) SIP1X02-041B	UL94 V-0	0.125 in	3.18 mm	0.1 in	2.54 mm	SIP	0.1 "	2.54 mm	Tin-Lead	200 µin	5.08 µm	Brass	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.76 Ám	30 Áin	Closed Frame	Through Hole	1 x 2	2	Gold	Solder