W25N02 Series
Manufacturer: Winbond Electronics
IC FLASH 2GBIT SPI/QUAD 8WSON
| Part | Memory Size | Supplier Device Package | Memory Interface | Operating Temperature [Max] | Operating Temperature [Min] | Write Cycle Time - Word, Page | Technology | Package / Case | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Organization | Memory Type | Mounting Type | Clock Frequency | Memory Format | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 2 Gbit | 8-WSON (8x6) | DTR Quad I/O SPI | 85 C | -40 ¯C | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | 1.95 V | 1.7 V | 256 M | Non-Volatile | Surface Mount | 166 MHz | FLASH | |
Winbond Electronics | 2 Gbit | 24-TFBGA (8x6) | SPI - Quad I/O | 85 C | -40 ¯C | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 3.6 V | 2.7 V | 256 M | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 24-TFBGA (8x6) | SPI - Quad I/O | 85 C | -40 ¯C | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 3.6 V | 2.7 V | 256 M | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 8-WSON (8x6) | SPI - Quad I/O | 85 C | -40 ¯C | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | 3.6 V | 2.7 V | 256 M | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 24-TFBGA (8x6) | SPI - Quad I/O | 85 C | -40 ¯C | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 3.6 V | 2.7 V | 256 M | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 24-TFBGA (8x6) | SPI - Quad I/O | 85 C | -40 ¯C | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 3.6 V | 2.7 V | 256 M | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 8-WSON (8x6) | SPI - Quad I/O | 85 C | -40 ¯C | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | 3.6 V | 2.7 V | 256 M | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 8-WSON (8x6) | SPI - Quad I/O | 85 C | -40 ¯C | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | 3.6 V | 2.7 V | 256 M | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 24-TFBGA (8x6) | SPI - Quad I/O | 85 C | -40 ¯C | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 1.95 V | 1.7 V | 256 M | Non-Volatile | Surface Mount | 104 MHz | FLASH | 8 ns |
Winbond Electronics | 2 Gbit | 24-TFBGA (8x6) | SPI - Quad I/O | 85 C | -40 ¯C | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 3.6 V | 2.7 V | 256 M | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |