W25N02 Series
Manufacturer: Winbond Electronics
IC FLASH 2GBIT SPI/QUAD 8WSON
| Part | Memory Format | Clock Frequency | Mounting Type | Memory Type | Memory Depth | Memory Width | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Package / Case | Technology | Write Cycle Time - Word | Write Cycle Time - Page | Operating Temperature (Max) | Operating Temperature (Min) | Memory Interface (Type) | Package Width | Package Name | Package Length | Memory Size | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | FLASH | 166 MHz | Surface Mount | Non-Volatile | 256 M | 8 bit | 1.7 V | 1.95 V | 8-WDFN Exposed Pad | FLASH - NAND (SLC) | 700 µs | 700 µs | 85 °C | -40 °C | DTR SPI - Quad I/O | 6 mm | 8-WSON | 8 mm | 2 Gbit | |
Winbond Electronics | FLASH | 104 MHz | Surface Mount | Non-Volatile | 256 M | 8 bit | 2.7 V | 3.6 V | 24-TBGA | FLASH - NAND (SLC) | 700 µs | 700 µs | 85 °C | -40 °C | SPI - Quad I/O | 6 mm | 24-TFBGA | 8 mm | 2 Gbit | 7 ns |
Winbond Electronics | FLASH | 104 MHz | Surface Mount | Non-Volatile | 256 M | 8 bit | 2.7 V | 3.6 V | 24-TBGA | FLASH - NAND (SLC) | 700 µs | 700 µs | 85 °C | -40 °C | SPI - Quad I/O | 6 mm | 24-TFBGA | 8 mm | 2 Gbit | 7 ns |
Winbond Electronics | FLASH | 104 MHz | Surface Mount | Non-Volatile | 256 M | 8 bit | 2.7 V | 3.6 V | 8-WDFN Exposed Pad | FLASH - NAND (SLC) | 700 µs | 700 µs | 85 °C | -40 °C | SPI - Quad I/O | 6 mm | 8-WSON | 8 mm | 2 Gbit | 7 ns |
Winbond Electronics | FLASH | 104 MHz | Surface Mount | Non-Volatile | 256 M | 8 bit | 2.7 V | 3.6 V | 24-TBGA | FLASH - NAND (SLC) | 700 µs | 700 µs | 85 °C | -40 °C | SPI - Quad I/O | 6 mm | 24-TFBGA | 8 mm | 2 Gbit | 7 ns |
Winbond Electronics | FLASH | 104 MHz | Surface Mount | Non-Volatile | 256 M | 8 bit | 2.7 V | 3.6 V | 24-TBGA | FLASH - NAND (SLC) | 700 µs | 700 µs | 85 °C | -40 °C | SPI - Quad I/O | 6 mm | 24-TFBGA | 8 mm | 2 Gbit | 7 ns |
Winbond Electronics | FLASH | 104 MHz | Surface Mount | Non-Volatile | 256 M | 8 bit | 2.7 V | 3.6 V | 8-WDFN Exposed Pad | FLASH - NAND (SLC) | 700 µs | 700 µs | 85 °C | -40 °C | SPI - Quad I/O | 6 mm | 8-WSON | 8 mm | 2 Gbit | 7 ns |
Winbond Electronics | FLASH | 104 MHz | Surface Mount | Non-Volatile | 256 M | 8 bit | 2.7 V | 3.6 V | 8-WDFN Exposed Pad | FLASH - NAND (SLC) | 700 µs | 700 µs | 85 °C | -40 °C | SPI - Quad I/O | 6 mm | 8-WSON | 8 mm | 2 Gbit | 7 ns |
Winbond Electronics | FLASH | 104 MHz | Surface Mount | Non-Volatile | 256 M | 8 bit | 1.7 V | 1.95 V | 24-TBGA | FLASH - NAND (SLC) | 700 µs | 700 µs | 85 °C | -40 °C | SPI - Quad I/O | 6 mm | 24-TFBGA | 8 mm | 2 Gbit | 8 ns |
Winbond Electronics | FLASH | 104 MHz | Surface Mount | Non-Volatile | 256 M | 8 bit | 2.7 V | 3.6 V | 24-TBGA | FLASH - NAND (SLC) | 700 µs | 700 µs | 85 °C | -40 °C | SPI - Quad I/O | 6 mm | 24-TFBGA | 8 mm | 2 Gbit | 7 ns |