W25N02 Series
Manufacturer: Winbond Electronics
Catalog
IC FLASH 2GBIT SPI/QUAD 8WSON
| Part | Memory Size | Package Width | Package Name | Package Length | Memory Interface (Type) | Operating Temperature (Max) | Operating Temperature (Min) | Write Cycle Time - Word | Write Cycle Time - Page | Technology | Package / Case | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Memory Depth | Memory Width | Memory Type | Mounting Type | Clock Frequency | Memory Format | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 2 Gbit | 6 mm | 8-WSON | 8 mm | DTR SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | 1.7 V | 1.95 V | 256 M | 8 bit | Non-Volatile | Surface Mount | 166 MHz | FLASH | |
Winbond Electronics | 2 Gbit | 6 mm | 24-TFBGA | 8 mm | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 2.7 V | 3.6 V | 256 M | 8 bit | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 6 mm | 24-TFBGA | 8 mm | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 2.7 V | 3.6 V | 256 M | 8 bit | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 6 mm | 8-WSON | 8 mm | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 256 M | 8 bit | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 6 mm | 24-TFBGA | 8 mm | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 2.7 V | 3.6 V | 256 M | 8 bit | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 6 mm | 24-TFBGA | 8 mm | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 2.7 V | 3.6 V | 256 M | 8 bit | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 6 mm | 8-WSON | 8 mm | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 256 M | 8 bit | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 6 mm | 8-WSON | 8 mm | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 256 M | 8 bit | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |
Winbond Electronics | 2 Gbit | 6 mm | 24-TFBGA | 8 mm | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 1.7 V | 1.95 V | 256 M | 8 bit | Non-Volatile | Surface Mount | 104 MHz | FLASH | 8 ns |
Winbond Electronics | 2 Gbit | 6 mm | 24-TFBGA | 8 mm | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 700 µs | FLASH - NAND (SLC) | 24-TBGA | 2.7 V | 3.6 V | 256 M | 8 bit | Non-Volatile | Surface Mount | 104 MHz | FLASH | 7 ns |