W25Q01 Series
Manufacturer: Winbond Electronics
IC FLASH 1GBIT SPI/QUAD 16SOIC
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Access Time | Memory Type | Memory Format | Package Name | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Write Cycle Time - Word | Write Cycle Time - Page | Technology | Memory Size | Mounting Type | Memory Depth | Memory Width | Memory Interface (Type) | Clock Frequency | Package Length | Package Width | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 85 °C | -40 °C | 7 ns | Non-Volatile | FLASH | 16-SOIC | 1.7 V | 1.95 V | 3 ms | 3 ms | FLASH - NOR | 1 Gbit | Surface Mount | 128 M | 8 bit | SPI - Quad I/O | 133 MHz | 0.295 in | 7.5 mm | |
Winbond Electronics | 85 °C | -40 °C | 7 ns | Non-Volatile | FLASH | 16-SOIC | 1.7 V | 1.95 V | 3 ms | 3 ms | FLASH - NOR | 1 Gbit | Surface Mount | 128 M | 8 bit | QPI SPI - Quad I/O | 133 MHz | 0.295 in | 7.5 mm | |
Winbond Electronics | 85 °C | -40 °C | 7.5 ns | Non-Volatile | FLASH | 24-TFBGA | 2.7 V | 3.6 V | 3.5 ms | 3.5 ms | FLASH - NOR | 1 Gbit | Surface Mount | 128 M | 8 bit | SPI - Quad I/O | 133 MHz | 8 mm | 6 mm | 24-TBGA |
Winbond Electronics | 85 °C | -40 °C | 7 ns | Non-Volatile | FLASH | 24-TFBGA | 1.7 V | 1.95 V | 3 ms | 3 ms | FLASH - NOR | 1 Gbit | Surface Mount | 128 M | 8 bit | QPI SPI - Quad I/O | 133 MHz | 8 mm | 6 mm | 24-TBGA |
Winbond Electronics | 85 °C | -40 °C | 7 ns | Non-Volatile | FLASH | 24-TFBGA | 1.7 V | 1.95 V | 3 ms | 3 ms | FLASH - NOR | 1 Gbit | Surface Mount | 128 M | 8 bit | QPI SPI - Quad I/O | 133 MHz | 8 mm | 6 mm | 24-TBGA |
Winbond Electronics | 85 °C | -40 °C | Non-Volatile | FLASH | 8-WSON | 2.7 V | 3.6 V | 3.5 ms | 3.5 ms | FLASH - NOR | 1 Gbit | Surface Mount | 128 M | 8 bit | SPI - Quad I/O | 133 MHz | 8 mm | 6 mm | 8-WDFN Exposed Pad |