W25Q01 Series
Manufacturer: Winbond Electronics
IC FLASH 1GBIT SPI/QUAD 16SOIC
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Access Time | Memory Type | Memory Format | Supplier Device Package | Voltage - Supply [Max] | Voltage - Supply [Min] | Write Cycle Time - Word, Page | Technology | Memory Size | Mounting Type | Memory Organization | Memory Interface | Clock Frequency | Package / Case | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 85 C | -40 ¯C | 7 ns | Non-Volatile | FLASH | 16-SOIC | 1.95 V | 1.7 V | 3 ms | FLASH - NOR | 1 Mbit | Surface Mount | 128 M | SPI - Quad I/O | 133 MHz | 16-SOIC | 7.5 mm | 0.295 " |
Winbond Electronics | 85 C | -40 ¯C | 7 ns | Non-Volatile | FLASH | 16-SOIC | 1.95 V | 1.7 V | 3 ms | FLASH - NOR | 1 Mbit | Surface Mount | 128 M | QPI SPI - Quad I/O | 133 MHz | 16-SOIC | 7.5 mm | 0.295 " |
Winbond Electronics | 85 C | -40 ¯C | 7.5 ns | Non-Volatile | FLASH | 24-TFBGA (8x6) | 3.6 V | 2.7 V | 3.5 ms | FLASH - NOR | 1 Mbit | Surface Mount | 128 M | SPI - Quad I/O | 133 MHz | 24-TBGA | ||
Winbond Electronics | 85 C | -40 ¯C | 7 ns | Non-Volatile | FLASH | 24-TFBGA (8x6) | 1.95 V | 1.7 V | 3 ms | FLASH - NOR | 1 Mbit | Surface Mount | 128 M | QPI SPI - Quad I/O | 133 MHz | 24-TBGA | ||
Winbond Electronics | 85 C | -40 ¯C | 7 ns | Non-Volatile | FLASH | 24-TFBGA (8x6) | 1.95 V | 1.7 V | 3 ms | FLASH - NOR | 1 Mbit | Surface Mount | 128 M | QPI SPI - Quad I/O | 133 MHz | 24-TBGA | ||
Winbond Electronics | 85 C | -40 ¯C | Non-Volatile | FLASH | 8-WSON (8x6) | 3.6 V | 2.7 V | 3.5 ms | FLASH - NOR | 1 Mbit | Surface Mount | 128 M | SPI - Quad I/O | 133 MHz | 8-WDFN Exposed Pad |