MPC8314 Series
Manufacturer: Freescale Semiconductor - NXP
MICROPROCESSOR, MPC8314 SERIES, 400 MHZ, TEPBGA-II-191
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Speed | USB | Core Processor | Number of Cores/Bus Width | Mounting Type | Ethernet | Ethernet | Supplier Device Package | Additional Interfaces | Voltage - I/O | RAM Controllers | Package / Case | Graphics Acceleration | Security Features | Co-Processors/DSP |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Freescale Semiconductor - NXP | 105 °C | -40 °C | 400 MHz | USB 2.0 + PHY (1) | PowerPC e300c3 | 1 Core 32 Bit | Surface Mount | 10 Mbps 100 Mbps 1000 Mbps | 2 | 620-HBGA (29x29) | DUART HSSI I2C PCI SPI TDM | 1.8 V 2.5 V 3.3 V | DDR DDR2 | 620-BBGA Exposed Pad | |||
Freescale Semiconductor - NXP | 105 °C | -40 °C | 333 MHz | USB 2.0 + PHY (1) | PowerPC e300c3 | 1 Core 32 Bit | Surface Mount | 10 Mbps 100 Mbps 1000 Mbps | 2 | 620-HBGA (29x29) | DUART HSSI I2C PCI SPI TDM | 1.8 V 2.5 V 3.3 V | DDR DDR2 | 620-BBGA Exposed Pad | |||
Freescale Semiconductor - NXP | 105 °C | -40 °C | 333 MHz | USB 2.0 + PHY (1) | PowerPC e300c3 | 1 Core 32 Bit | Surface Mount | 10 Mbps 100 Mbps 1000 Mbps | 2 | 620-HBGA (29x29) | DUART HSSI I2C PCI SPI TDM | 1.8 V 2.5 V 3.3 V | DDR DDR2 | 620-BBGA Exposed Pad | |||
Freescale Semiconductor - NXP | 105 °C | -40 °C | 266 MHz | USB 2.0 + PHY (1) | PowerPC e300c3 | 1 Core 32 Bit | Surface Mount | 10 Mbps 100 Mbps 1000 Mbps | 2 | 620-HBGA (29x29) | DUART HSSI I2C PCI SPI TDM | 1.8 V 2.5 V 3.3 V | DDR DDR2 | 620-BBGA Exposed Pad | Cryptography Random Number Generator | SEC 3.3 Security |