BHI360 Series
Manufacturer: Bosch Sensortec GmbH
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SHUTTLE BOARD 3.0 BHI360
| Part | Interconnect System | Function | Contents | Utilized IC / Part | Type | Output Type | Operating Temperature (Min) | Operating Temperature (Max) | Package Name | Package Width | Package Length | Package / Case | Sensor Type | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Bosch Sensortec GmbH | Shuttle Board 3.0 Socket | Accelerometer Air Quality Gyroscope Humidity Magnetometer Pressure Temperature | Board | BHI360 BME688 BMM150 BMM350 BMP580 | Sensor | |||||||||
 Bosch Sensortec GmbH | I2C SPI | -40 °C | 85 °C | 20-LGA | 3 mm | 2.5 mm | 20-VFLGA | 6 Axis Accelerometer Gyroscope | Surface Mount |