CMP Series
Manufacturer: Bourns Inc.
SMD CHIP RESISTOR, 100 KOHM, ± 1%, 250 MW, 0603 [1608 METRIC], THICK FILM, ANTI-SURGE
| Part | Composition | Number of Terminations [custom] | Features | Temperature Coefficient | Tolerance | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case | Package / Case | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [x] | Power (Watts) | Power (Watts) | Resistance | Height - Seated (Max) [Max] | Height - Seated (Max) [Max] | Supplier Device Package | Size / Dimension [y] | Height - Seated (Max) [Max] [z] | Height - Seated (Max) [Max] [z] | Supplier Device Package | Power (Watts) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bourns Inc. | Thick Film | 2 | Pulse Withstanding | 100 ppm/°C | 1 % | 155 C | -55 C | 1608 Metric | 0603 | 0.031 in | 1.6 mm | 0.8 mm | 0.063 " | 0.25 W | 0.25 W | 100 kOhms | 0.55 mm | 0.022 in | ||||||
Bourns Inc. | Thick Film | 2 | Pulse Withstanding | 100 ppm/°C | 1 % | 155 C | -55 C | 1608 Metric | 0603 | 0.031 in | 1.6 mm | 0.8 mm | 0.063 " | 0.25 W | 0.25 W | 100 Ohms | 0.55 mm | 0.022 in | ||||||
Bourns Inc. | Thick Film | 2 | Pulse Withstanding | 100 ppm/°C | 1 % | 155 C | -55 C | 2010 (5025 Metric) | 0.098 in | 5 mm | 0.197 in | 1 W | 15 kOhms | 2010 | 2.5 mm | 0.7 mm | 0.028 " | |||||||
Bourns Inc. | Thick Film | 2 | Pulse Withstanding | 100 ppm/°C | 1 % | 155 C | -55 C | 1206 (3216 Metric) | 0.063 " | 3.1 mm | 0.122 " | 0.75 W | 1 MOhms | 0.65 mm | 0.026 in | 1.6 mm | 1206 | 3/4W | ||||||
Bourns Inc. | Thick Film | 2 | Pulse Withstanding | 100 ppm/°C | 1 % | 155 C | -55 C | 1608 Metric | 0603 | 0.031 in | 1.6 mm | 0.8 mm | 0.063 " | 0.25 W | 0.25 W | 330 Ohms | 0.55 mm | 0.022 in | ||||||
Bourns Inc. | Thick Film | 2 | Pulse Withstanding | 100 ppm/°C | 1 % | 155 C | -55 C | 0805 | 0.049 " | 2 mm | 0.079 in | 0.5 W | 0.5 W | 27 Ohms | 0.6 mm | 0.024 in | 1.25 mm | 0805 |