88MW302 Series
Manufacturer: NXP USA Inc.
Beta
⌘K
1X1 802.11N SINGLE BAND SINGLE-CHIP MAC/BB/RF WLAN SOC WITH INTEGRATED MCU (E TEMP) IN TRAY/ TRAY ROHS COMPLIANT: YES
| Part | RF Family/Standard | Protocol | Operating Temperature (Max) | Operating Temperature (Min) | Voltage - Supply | Data Rate (Max) | Package Name | Package Length | Package Width | GPIO Count | Modulation | Type | Frequency | Mounting Type | Serial Interfaces | Memory Type | Memory Size (ROM) | Memory Size (SRAM) | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 NXP USA Inc. | Bluetooth WiFi | 802.11b 802.11g 802.11n Bluetooth Z-Wave® Zigbee® | 85 °C | -40 °C | 3.3 V | 72.2 Mbps | 88-HVQFN | 10 mm | 10 mm | 50 | DSSS OFDM | TxRx + MCU | 2.4 GHz | Surface Mount | I2C I2S PWM SPI UART | ROM SRAM | 128 kB | 512 kB | 88-VFQFN Exposed Pad |
NXP USA Inc. | Bluetooth WiFi | 802.11b 802.11g 802.11n Bluetooth Z-Wave® Zigbee® | 85 °C | -40 °C | 3.3 V | 72.2 Mbps | 88-HVQFN | 10 mm | 10 mm | 50 | DSSS OFDM | TxRx + MCU | 2.4 GHz | Surface Mount | I2C I2S PWM SPI UART | ROM SRAM | 128 kB | 512 kB | 88-VFQFN Exposed Pad |
 NXP USA Inc. | Bluetooth WiFi | 802.11b 802.11g 802.11n Bluetooth Z-Wave® Zigbee® | 85 °C | -40 °C | 3.3 V | 72.2 Mbps | 88-HVQFN | 10 mm | 10 mm | 50 | DSSS OFDM | TxRx + MCU | 2.4 GHz | Surface Mount | I2C I2S PWM SPI UART | ROM SRAM | 128 kB | 512 kB | 88-VFQFN Exposed Pad |