W66CL2 Series
Manufacturer: Winbond Electronics
IC DRAM 4GBIT LVSTL 11 200WFBGA
| Part | Write Cycle Time - Word, Page | Mounting Type | Package / Case | Clock Frequency | Memory Format | Technology | Memory Organization | Operating Temperature [Min] | Operating Temperature [Max] | Memory Interface | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Type | Supplier Device Package | Access Time | Memory Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 18 ns | Surface Mount | 200-WFBGA | 1600 MHz | DRAM | SDRAM - Mobile LPDDR4 | 128 M | -40 °C | 105 °C | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V | Volatile | 200-WFBGA (10x14.5) | 3.5 ns | 512 kB |
Winbond Electronics | 18 ns | Surface Mount | 200-WFBGA | 2.133 GHz | DRAM | SDRAM - Mobile LPDDR4 | 128 M | -40 °C | 105 °C | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V | Volatile | 200-WFBGA (10x14.5) | 3.5 ns | 512 kB |
Winbond Electronics | 18 ns | Surface Mount | 200-WFBGA | 1866 MHz | DRAM | SDRAM - Mobile LPDDR4 | 128 M | -40 °C | 105 °C | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V | Volatile | 200-WFBGA (10x14.5) | 3.5 ns | 512 kB |
Winbond Electronics | 18 ns | Surface Mount | 200-WFBGA | 2.133 GHz | DRAM | SDRAM - Mobile LPDDR4 | 256 M | -40 °C | 95 °C | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V | Volatile | 200-WFBGA (10x14.5) | 512 kB | |
Winbond Electronics | 18 ns | Surface Mount | 200-WFBGA | 1866 MHz | DRAM | SDRAM - Mobile LPDDR4 | 128 M | -40 °C | 105 °C | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V | Volatile | 200-WFBGA (10x14.5) | 3.5 ns | 512 kB |