TPA751 Series

700-mW, mono, analog input, Class-AB audio amplifier in BGA packaging

Catalog

700-mW, mono, analog input, Class-AB audio amplifier in BGA packaging

Part	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Max Output Power x Channels @ Load	Supplier Device Package	Features	Voltage - Supply [Min]	Voltage - Supply [Max]	Output Type	Package / Case	Package / Case [custom]	Type	Package / Case [y]	Package / Case [x]	Amplifier Type	Board Type	Supplied Contents	Utilized IC / Part
Texas Instruments TPA751DGNR	85 °C	-40 °C	Surface Mount	1 700 mW	8-HVSSOP	Differential Inputs Short-Circuit and Thermal Protection Shutdown	2.5 V	5.5 V	1-Channel (Mono)	8-MSOP 8-TSSOP Exposed Pad	0.118 in 3 mm	Class AB
Texas Instruments TPA751DR	85 °C	-40 °C	Surface Mount	1 700 mW	8-SOIC	Differential Inputs Short-Circuit and Thermal Protection Shutdown	2.5 V	5.5 V	1-Channel (Mono)	8-SOIC		Class AB	3.9 mm	0.154 in
Texas Instruments TPA751D	85 °C	-40 °C	Surface Mount	1 700 mW	8-SOIC	Differential Inputs Short-Circuit and Thermal Protection Shutdown	2.5 V	5.5 V	1-Channel (Mono)	8-SOIC		Class AB	3.9 mm	0.154 in
Texas Instruments TPA751DGNRG4	85 °C	-40 °C	Surface Mount	1 700 mW	8-HVSSOP	Differential Inputs Short-Circuit and Thermal Protection Shutdown	2.5 V	5.5 V	1-Channel (Mono)	8-MSOP 8-TSSOP Exposed Pad	0.118 in 3 mm	Class AB
Texas Instruments TPA751GQSR	85 °C	-40 °C	Surface Mount	1 700 mW	24-BGA MICROSTAR JUNIOR (3x3)	Differential Inputs Short-Circuit and Thermal Protection Shutdown	2.5 V	5.5 V	1-Channel (Mono)	24-VFBGA		Class AB
Texas Instruments TPA751EVM				1 700 mW			2.5 V	5.5 V	1-Channel (Mono)						Class AB	Fully Populated	Board(s)	TPA751

Catalog

700-mW, mono, analog input, Class-AB audio amplifier in BGA packaging

Key Features

• Fully Specified for 3.3-V and 5-V OperationWide Power Supply Compatibility 2.5 V – 5.5 VPower Supply Rejection at 217 Hz84 dB at VDD= 5 V81 dB at VDD= 3.3 VOutput Power for RL= 8700 mW at VDD= 5 V250 mW at VDD= 3.3 VUltralow Supply Current in Shutdown Mode . . . 1.5 nAThermal and Short-Circuit ProtectionSurface-Mount PackagingSOICPowerPAD™ MSOPMicroStar Junior™ (BGA)PowerPAD and MicroStar Junior are trademarks of Texas Instruments.Fully Specified for 3.3-V and 5-V OperationWide Power Supply Compatibility 2.5 V – 5.5 VPower Supply Rejection at 217 Hz84 dB at VDD= 5 V81 dB at VDD= 3.3 VOutput Power for RL= 8700 mW at VDD= 5 V250 mW at VDD= 3.3 VUltralow Supply Current in Shutdown Mode . . . 1.5 nAThermal and Short-Circuit ProtectionSurface-Mount PackagingSOICPowerPAD™ MSOPMicroStar Junior™ (BGA)PowerPAD and MicroStar Junior are trademarks of Texas Instruments.

Description

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP. The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.