518-77 Series
Manufacturer: Preci-Dip
CONN SOCKET PGA 400POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Resistance | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Post | Pitch - Post | Termination | Contact Material - Mating | Contact Material - Post [custom] | Features | Housing Material | Type | Mounting Type | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Preci-Dip | 0.11 in | 2.78 mm | UL94 V-0 | 10 mOhm | 1 A | 1.27 mm | 0.05 in | Flash | Gold | Gold | -55 C | 125 °C | 0.05 in | 1.27 mm | Solder | Beryllium Copper | Brass | Closed Frame | FR4 Epoxy Glass | PGA | Through Hole | Flash | 20 | 20 | 400 | |||
Preci-Dip | 0.11 in | 2.78 mm | UL94 V-0 | 10 mOhm | 1 A | 1.27 mm | 0.05 in | Flash | Gold | Gold | -55 C | 125 °C | 0.05 in | 1.27 mm | Solder | Beryllium Copper | Brass | Open Frame | FR4 Epoxy Glass | PGA | Through Hole | Flash | 19 | 19 | 357 | |||
Preci-Dip | 0.062 in | 1.57 mm | UL94 V-0 | 10 mOhm | 1 A | 1.27 mm | 0.05 in | Flash | Gold | Gold | -55 C | 125 °C | 0.05 in | 1.27 mm | Solder | Beryllium Copper | Brass | Closed Frame | FR4 Epoxy Glass | PGA | Surface Mount | Flash | 20 | 20 | 400 | |||
Preci-Dip | 0.11 in | 2.78 mm | UL94 V-0 | 10 mOhm | 1 A | 1.27 mm | 0.05 in | Flash | Gold | Gold | -55 C | 125 °C | 0.05 in | 1.27 mm | Solder | Beryllium Copper | Brass | Open Frame | FR4 Epoxy Glass | PGA | Through Hole | Flash | 31 | 31 | 520 | |||
Preci-Dip | 0.062 in | 1.57 mm | UL94 V-0 | 10 mOhm | 1 A | 1.27 mm | 0.05 in | Flash | Gold | Gold | -55 C | 125 °C | 0.05 in | 1.27 mm | Solder | Beryllium Copper | Brass | Open Frame | FR4 Epoxy Glass | PGA | Surface Mount | Flash | 652 positions | |||||
Preci-Dip | 0.062 in | 1.57 mm | UL94 V-0 | 10 mOhm | 1 A | 1.27 mm | 0.05 in | Flash | Gold | Gold | -55 C | 125 °C | 0.05 in | 1.27 mm | Solder | Beryllium Copper | Brass | Open Frame | FR4 Epoxy Glass | PGA | Surface Mount | Flash | 255 | 16x16 | ||||
Preci-Dip | 0.11 in | 2.78 mm | UL94 V-0 | 10 mOhm | 1 A | 1.27 mm | 0.05 in | Flash | Gold | Gold | -55 C | 125 °C | 0.05 in | 1.27 mm | Solder | Beryllium Copper | Brass | Open Frame | FR4 Epoxy Glass | PGA | Through Hole | Flash | 29 | 29 | 480 | |||
Preci-Dip | 0.062 in | 1.57 mm | UL94 V-0 | 10 mOhm | 1 A | 1.27 mm | 0.05 in | Flash | Gold | Gold | -55 C | 125 °C | 0.05 in | 1.27 mm | Solder | Beryllium Copper | Brass | Open Frame | FR4 Epoxy Glass | PGA | Surface Mount | Flash | 33 | 33 | 560 | |||
Preci-Dip | 0.11 in | 2.78 mm | UL94 V-0 | 10 mOhm | 1 A | 1.27 mm | 0.05 in | Flash | Gold | Gold | -55 C | 125 °C | 0.05 in | 1.27 mm | Solder | Beryllium Copper | Brass | Open Frame | FR4 Epoxy Glass | PGA | Through Hole | Flash | 26 | 26 | 456 | |||
Preci-Dip | 0.11 in | 2.78 mm | UL94 V-0 | 10 mOhm | 1 A | 1.27 mm | 0.05 in | Flash | Gold | Gold | -55 C | 125 °C | 0.05 in | 1.27 mm | Solder | Beryllium Copper | Brass | Open Frame | FR4 Epoxy Glass | PGA | Through Hole | Flash | 26 | 26 | 356 |