TS391S Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
THERMALLY STABLE SOLDER PASTE NO
| Part | Composition | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Form | Form | Form | Shelf Life | Melting Point [Max] | Melting Point [Max] | Melting Point [Min] | Melting Point [Min] | Mesh Type | Shelf Life Start | Type | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 25 °C | 20 °C | 1.23 oz 10 cc | 35 g | Syringe | 12 Months | 428 °F | 220 °C | 423 °F | 217 °C | 4 | Date of Manufacture | Solder Paste | No-Clean |