APF30 Series

Catalog

HEATSINK LOW-PROFILE FORGED

Part	Material Finish	Package Cooled	Fin Height	Fin Height	Width [x]	Width [x]	Thermal Resistance @ Forced Air Flow	Length	Length	Shape	Type	Material	Attachment Method	Shelf Life	Fin Height [custom]	Fin Height [custom]
CTS Thermal Management Products APF30-30-06CB	Black Anodized	ASIC BGA CPU LGA	6.35 mm	0.25 in	30 mm	1.181 in	4.4 °C/W	0.03 m	1.181 in	Fins Square	Top Mount	Aluminum	Thermal Tape Adhesive
CTS Thermal Management Products APF30-30-06CB/A01	Black Anodized	ASIC BGA CPU LGA	6.35 mm	0.25 in	30 mm	1.181 in	4.4 °C/W	0.03 m	1.181 in	Fins Square	Top Mount	Aluminum	Thermal Tape Adhesive (Included)	24 Months
CTS Thermal Management Products APF303010CBA01	Black Anodized	ASIC BGA CPU LGA			30 mm	1.181 in	3.3 °C/W	0.03 m	1.181 in	Fins Square	Top Mount	Aluminum	Thermal Tape Adhesive (Included)	24 Months	0.37 in	9.4 mm
CTS Thermal Management Products APF30-30-13CB/A01	Black Anodized	ASIC BGA CPU LGA	12.7 mm	0.5 "	30 mm	1.181 in	2.5 °C/W	0.03 m	1.181 in	Fins Square	Top Mount	Aluminum	Thermal Tape Adhesive (Included)	24 Months
CTS Thermal Management Products APF30-30-13CB	Black Anodized	ASIC BGA CPU LGA	12.7 mm	0.5 "	30 mm	1.181 in	2.5 °C/W	0.03 m	1.181 in	Fins Square	Top Mount	Aluminum	Thermal Tape Adhesive
CTS Thermal Management Products APF30-30-10CB	Black Anodized	ASIC BGA CPU LGA			30 mm	1.181 in	3.3 °C/W	0.03 m	1.181 in	Fins Square	Top Mount	Aluminum	Thermal Tape Adhesive		0.37 in	9.4 mm