AGLE600 Series
Manufacturer: Microsemi Corporation
IC FPGA 270 I/O 484FBGA
| Part | Number of I/O | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package | Number of Gates | Voltage - Supply [Min] | Voltage - Supply [Max] | Package / Case | Number of Logic Elements/Cells | Mounting Type | Total RAM Bits |
|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation | 270 | 85 C | -40 ¯C | 484-FPBGA (23x23) | 600000 | 1.425 V | 1.575 V | 484-BGA | 13824 | Surface Mount | 110592 bits |
Microsemi Corporation | 270 | 85 C | -40 ¯C | 484-FPBGA (23x23) | 600000 | 1.425 V | 1.575 V | 484-BGA | 13824 | Surface Mount | 110592 bits |
Microsemi Corporation | 270 | 85 C | -40 ¯C | 484-FPBGA (23x23) | 600000 | 1.14 V | 1.575 V | 484-BGA | 13824 | Surface Mount | 110592 bits |
Microsemi Corporation | 270 | 70 °C | 0 °C | 484-FPBGA (23x23) | 600000 | 1.425 V | 1.575 V | 484-BGA | 13824 | Surface Mount | 110592 bits |
Microsemi Corporation | 270 | 70 °C | 0 °C | 484-FPBGA (23x23) | 600000 | 1.14 V | 1.575 V | 484-BGA | 13824 | Surface Mount | 110592 bits |
Microsemi Corporation | 270 | 70 °C | 0 °C | 484-FPBGA (23x23) | 600000 | 1.425 V | 1.575 V | 484-BGA | 13824 | Surface Mount | 110592 bits |