GD25D10 Series
Manufacturer: GigaDevice Semiconductor (HK) Limited
IC FLASH 1MBIT SPI/DUAL 8USON
| Part | Technology | Operating Temperature (Max) | Operating Temperature (Min) | Package / Case | Memory Interface (Type) | Memory Size | Memory Type | Clock Frequency | Mounting Type | Memory Depth | Memory Width | Write Cycle Time - Word | Write Cycle Time - Page | Memory Format | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Package Width | Package Name | Package Length | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | FLASH - NOR | 85 °C | -40 °C | 8-XFDFN Exposed Pad | SPI - Dual I/O | 1 Mbit | Non-Volatile | 100 MHz | Surface Mount | 128 K | 8 bit | 50 µs | 4 ms | FLASH | 3.6 V | 2.7 V | 3 mm | 8-USON | 2 mm | |
GigaDevice Semiconductor (HK) Limited | FLASH - NOR (SLC) | 125 °C | -40 °C | SPI - Dual I/O | 1 Mbit | Non-Volatile | 100 MHz | Surface Mount | 128 K | 8 bit | 80 µs | 4 ms | FLASH | 3.6 V | 2.7 V | 3.9 mm | 8-SOIC 8-SOP | 0.154 in | 6 ns | |
GigaDevice Semiconductor (HK) Limited | FLASH - NOR | 85 °C | -40 °C | SPI - Dual I/O | 1 Mbit | Non-Volatile | 100 MHz | Surface Mount | 128 K | 8 bit | 50 µs | 4 ms | FLASH | 3.6 V | 2.7 V | 3.9 mm | 8-SOIC 8-SOP | 0.154 in | ||
GigaDevice Semiconductor (HK) Limited | FLASH - NOR | 85 °C | -40 °C | 8-XFDFN Exposed Pad | SPI - Dual I/O | 1 Mbit | Non-Volatile | 100 MHz | Surface Mount | 128 K | 8 bit | 50 µs | 4 ms | FLASH | 3.6 V | 2.7 V | 1.5 mm | 8-USON | 1.5 mm |