10063960 Series
Manufacturer: Amphenol ICC (FCI)
Beta
⌘K
CONN PCI EXP FMALE 230POS 0.039
| Part | Material - Insulation | Gender | Contact Finish Thickness | Contact Finish Thickness | Card Type | Contact Finish | Read Out | Termination | Features | Number of Rows [custom] | Pitch | Pitch | Mounting Type | Card Thickness | Card Thickness | Contact Material | Color | Number of Positions | Contact Type | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Pitch [x] | Pitch [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Amphenol ICC (FCI) | Thermoplastic Glass Filled | Female | 30 Áin | 0.76 Ám | PCI Express™ | Gold | Dual | Solder Staggered | Board Guide Locking Ramp | 2 | 1 mm | 0.039 in | Through Hole | 1.57 mm | 0.062 in | Copper Alloy | Black | 230 | |||||
 Amphenol ICC (FCI) | Thermoplastic Glass Filled | Female | 15 µin | 0.38 µm | PCI Express™ | Gold | Dual | Solder Staggered | Board Guide Locking Ramp | 2 | 1 mm | 0.039 in | Through Hole | 1.57 mm | 0.062 in | Copper Alloy | Black | 230 | |||||
Amphenol ICC (FCI) | Thermoplastic Glass Filled | Female | 30 Áin | 0.76 Ám | PCI Express™ | Gold | Dual | Solder Staggered | Board Guide Locking Ramp | 2 | 1 mm | 0.039 in | Through Hole | 1.57 mm | 0.062 in | Copper Alloy | Black | 230 | |||||
Amphenol ICC (FCI) | Thermoplastic Glass Filled | Female | 15 µin | 0.38 µm | PCI Express™ | Gold | Dual | Solder | Board Guide Locking Ramp | 2 | Through Hole | 1.57 mm | 0.062 in | Copper Alloy | Black | 230 | Cantilever | 11 | 104 | 0.079 in | 2 mm |