Catalog
HSAutoLink II Unsealed Header, Vertical, 6 Circuits, Key A, Black
Beta
⌘K
HSAutoLink II Unsealed Header, Vertical, 6 Circuits, Key A, Black
HSAutoLink II Unsealed Header, Vertical, 6 Circuits, Key A, Black
| Part | Contact Finish - Post | Contact Material | Insulation Height | Insulation Height | Contact Type | Insulation Color | Number of Positions | Pitch - Mating | Pitch - Mating | Voltage Rating | Number of Positions Loaded | Insulation Material | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Contact Length - Post | Contact Length - Post | Contact Shape | Style | Number of Rows [custom] | Fastening Type | Connector Type | Current Rating (Amps) | Features | Termination | Contact Finish - Mating | Shrouding | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Molex | Tin | Copper Alloy | 0.713 in | 18.1 mm | Male Pin | Black | 6 | 1.27 mm | 0.05 in | 36 VDC | All | Glass Filled Syndiotactic Polystyrene (SPS) | 0.065 in | 1.65 mm | -40 C | 105 ░C | Through Hole | 0.118 in | 3 mm | Rectangular | Board to Cable/Wire | 2 | Push-Pull | Header | 1.5 A | Board Guide | Solder | Gold | Shrouded - 4 Wall | |||||
 Molex | ||||||||||||||||||||||||||||||||||
 Molex | Tin | Copper Alloy | Male Pin | Black | 6 | 1.27 mm | 0.05 in | 36 VDC | All | Glass Filled Syndiotactic Polystyrene (SPS) | -40 C | 105 ░C | Through Hole | Rectangular | Board to Cable/Wire | 2 | Header | 1.5 A | Board Guide Solder Retention | Solder | Gold | Shrouded - 4 Wall | 2.5 µm | 98.4 µin | UL94 HB | 16 Áin | 0.41 Ám | |||||||
Molex |