H8502 Series
Manufacturer: Harwin Inc.
Beta
⌘K
PCB SOCKET
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Insertion Force [Max] | Insertion Force [Min] | Tail Type | Contact Finish | Termination | Contact Material | Contact Finish Thickness | Contact Finish Thickness | Accepts Pin Diameter [Max] | Accepts Pin Diameter [Min] | Accepts Pin Diameter [Max] | Accepts Pin Diameter [Min] | Socket Depth | Socket Depth | Mounting Hole Diameter [Min] | Mounting Hole Diameter [Min] | Mounting Hole Diameter [Max] | Mounting Hole Diameter [Max] | Flange Diameter [diameter] | Flange Diameter [diameter] | Length - Overall [x] | Length - Overall [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Harwin Inc. | -55 C | 125 °C | 5.01 N | 1.5 N | No Tail | Tin | Knurled Press-Fit | Beryllium Copper | 4 µm | 157.5 µin | 0.033 " | 0.024 " | 0.85 mm | 0.6 mm | 0.183 in | 4.65 mm | 1.91 mm | 0.075 " | 0.077 " | 1.96 mm | 2.67 mm | 0.105 in | 0.232 " | 5.89 mm |
 Harwin Inc. | -55 C | 125 °C | 5.01 N | 1.5 N | No Tail | Gold | Knurled Press-Fit | Beryllium Copper | 0.033 " | 0.024 " | 0.85 mm | 0.6 mm | 0.183 in | 4.65 mm | 1.91 mm | 0.075 " | 0.077 " | 1.96 mm | 2.67 mm | 0.105 in | 0.232 " | 5.89 mm | ||
 Harwin Inc. | -55 C | 125 °C | 5.01 N | 1.5 N | No Tail | Gold | Knurled Press-Fit | Beryllium Copper | 0.15 µm | 5.9 µin | 0.033 " | 0.024 " | 0.85 mm | 0.6 mm | 0.183 in | 4.65 mm | 1.91 mm | 0.075 " | 0.077 " | 1.96 mm | 2.67 mm | 0.105 in | 0.232 " | 5.89 mm |