BDN12 Series
Manufacturer: CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.21"SQ
| Part | Shelf Life | Shape | Package Cooled | Thermal Resistance @ Forced Air Flow | Width [y] | Width [y] | Material Finish | Thermal Resistance @ Natural | Fin Height [z] | Fin Height [z] | Length | Length | Material | Attachment Method | Type | Fin Height [custom] | Fin Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products | 24 Months | Pin Fins Square | ASIC BGA CPU LGA | 5.2 °C/W | 1.21 in | 30.73 mm | Black Anodized | 16.5 °C/W | 14.1 mm | 0.555 in | 30.73 mm | 1.21 in | Aluminum | Thermal Tape Adhesive (Included) | Top Mount | ||
CTS Thermal Management Products | 24 Months | Pin Fins Square | ASIC BGA CPU LGA | 6.8 °C/W | 1.21 in | 30.73 mm | Black Anodized | 19.6 °C/W | 30.73 mm | 1.21 in | Aluminum | Thermal Tape Adhesive (Included) | Top Mount | 0.355 in | 9.02 mm |