FS8400 Series
Manufacturer: NXP USA Inc.
POWER MANAGEMENT SPECIALIZED - PMIC SAFETY POWER MANAGEMENT IC, QFN56
| Part | Current - Supply | Grade | Applications | Qualification | Voltage - Supply | Mounting Type | Package Width | Package Name | Package Length | Operating Temperature (Max) | Operating Temperature (Min) | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | 15 mA | Automotive | System Basis Chip | AEC-Q100 | 60 VDC | Surface Mount Wettable Flank | 8 mm | 56-HVQFN | 8 mm | 125 °C | -40 °C | 56-VFQFN Exposed Pad |
NXP USA Inc. | 15 mA | Automotive | System Basis Chip | AEC-Q100 | 60 VDC | Surface Mount Wettable Flank | 7 mm | 48-HVQFN | 7 mm | 125 °C | -40 °C | 48-VFQFN Exposed Pad |
NXP USA Inc. | 15 mA | Automotive | System Basis Chip | AEC-Q100 | 60 VDC | Surface Mount Wettable Flank | 8 mm | 56-HVQFN | 8 mm | 125 °C | -40 °C | 56-VFQFN Exposed Pad |
NXP USA Inc. | 15 mA | Automotive | System Basis Chip | AEC-Q100 | 60 VDC | Surface Mount Wettable Flank | 8 mm | 56-HVQFN | 8 mm | 125 °C | -40 °C | 56-VFQFN Exposed Pad |
NXP USA Inc. | 15 mA | Automotive | System Basis Chip | AEC-Q100 | 60 VDC | Surface Mount Wettable Flank | 8 mm | 56-HVQFN | 8 mm | 125 °C | -40 °C | 56-VFQFN Exposed Pad |