TXS0206-29 Series
MMC, SD Card, MemoryStick Voltage-Translation With ESD Protection, EMI Filtering, and 2.9 V LDO
Manufacturer: Texas Instruments
Catalog
MMC, SD Card, MemoryStick Voltage-Translation With ESD Protection, EMI Filtering, and 2.9 V LDO
Key Features
• Level TranslatorVCCARange of 1.1 V to 3.6 VFast Propagation Delay (4 ns Max WhenTranslating Between 1.8 V and 2.9 V)Low-Dropout (LDO) Regulator200-mA LDO Regulator With Enable2.9-V Output Voltage3.05-V to 5.5-V Input Voltage RangeVery Low Dropout: 200 mV at 200 mAESD Protection Exceeds JESD 22 (A Port)2000-V Human-Body Model (A114-B)1000-V Charged-Device Model (C101)±8-kV Contact Discharge IEC 61000-4-2 ESD (B Port)All other trademarks are the property of their respective owners.Level TranslatorVCCARange of 1.1 V to 3.6 VFast Propagation Delay (4 ns Max WhenTranslating Between 1.8 V and 2.9 V)Low-Dropout (LDO) Regulator200-mA LDO Regulator With Enable2.9-V Output Voltage3.05-V to 5.5-V Input Voltage RangeVery Low Dropout: 200 mV at 200 mAESD Protection Exceeds JESD 22 (A Port)2000-V Human-Body Model (A114-B)1000-V Charged-Device Model (C101)±8-kV Contact Discharge IEC 61000-4-2 ESD (B Port)All other trademarks are the property of their respective owners.
Description
AI
The TXS0206-29 is a complete solution for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It is comprised of a high-speed level translator, a low-dropout (LDO) voltage regulator, IEC level ESD protection, and EMI filtering circuitry.
The voltage-level translator has two supply voltage pins. VCCAcan be operated over the full range of 1.1 V to 3.6 V. VCCBis set at 2.9 V and is supplied by an internal LDO. The integrated LDO accepts input voltages from 3.05 V to as high as 5.5 V and outputs 2.9 V, 200 mA to the B-side circuitry and to the external memory card. The TXS0206-29 enables system designers to easily interface low-voltage microprocessors to memory cards operating at 2.9 V.
Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206-29 incorporates ±8-kV Contact Discharge protection on the card side.
Since memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206-29 an ideal choice for these applications. The TXS0206-29 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings.
The TXS0206-29 is a complete solution for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It is comprised of a high-speed level translator, a low-dropout (LDO) voltage regulator, IEC level ESD protection, and EMI filtering circuitry.
The voltage-level translator has two supply voltage pins. VCCAcan be operated over the full range of 1.1 V to 3.6 V. VCCBis set at 2.9 V and is supplied by an internal LDO. The integrated LDO accepts input voltages from 3.05 V to as high as 5.5 V and outputs 2.9 V, 200 mA to the B-side circuitry and to the external memory card. The TXS0206-29 enables system designers to easily interface low-voltage microprocessors to memory cards operating at 2.9 V.
Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206-29 incorporates ±8-kV Contact Discharge protection on the card side.
Since memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206-29 an ideal choice for these applications. The TXS0206-29 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings.
