W25Q128 Series
Manufacturer: Winbond Electronics
IC FLASH 128MBIT SPI/QUAD 8WSON
| Part | Memory Format | Package / Case | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Size | Memory Interface | Technology | Mounting Type | Clock Frequency | Operating Temperature [Min] | Operating Temperature [Max] | Write Cycle Time - Word, Page | Memory Organization | Supplier Device Package | Memory Type | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Package / Case | Package / Case | Package / Case | Write Cycle Time - Word, Page [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | FLASH | 8-WDFN Exposed Pad | 3.6 V | 2.7 V | 16 MB | DTR QPI SPI - Quad I/O | FLASH - NOR | Surface Mount | 133 MHz | -40 °C | 105 °C | 3 ms | 16M x 8 | 8-WSON (6x5) | Non-Volatile | ||||||
Winbond Electronics | FLASH | 24-TBGA | 3.6 V | 2.7 V | 16 MB | QPI SPI - Quad I/O | FLASH - NOR | Surface Mount | 104 MHz | -40 ¯C | 85 C | 16M x 8 | 24-TFBGA (6x8) | Non-Volatile | 50 µs | 3 ms | |||||
Winbond Electronics | FLASH | 24-TBGA | 3.6 V | 2.7 V | 16 MB | SPI - Quad I/O | FLASH - NOR | Surface Mount | 104 MHz | -40 °C | 105 °C | 16M x 8 | 24-TFBGA (6x8) | Non-Volatile | 50 µs | 3 ms | |||||
Winbond Electronics | FLASH | 8-WDFN Exposed Pad | 3.6 V | 2.7 V | 16 MB | SPI - Quad I/O | FLASH - NOR | Surface Mount | 104 MHz | -40 °C | 105 °C | 16M x 8 | 8-WSON (8x6) | Non-Volatile | 50 µs | 3 ms | |||||
Winbond Electronics | FLASH | 8-SOIC | 1.95 V | 1.65 V | 16 MB | QPI SPI - Quad I/O | FLASH - NOR | Surface Mount | 104 MHz | -40 ¯C | 85 C | 16M x 8 | 8-SOIC | Non-Volatile | 60 µs | 5 ms | 0.209 in 5.3 mm | ||||
Winbond Electronics | FLASH | 8-WDFN Exposed Pad | 3.6 V | 2.7 V | 16 MB | QPI SPI - Quad I/O | FLASH - NOR | Surface Mount | 104 MHz | -40 °C | 105 °C | 16M x 8 | 8-WSON (6x5) | Non-Volatile | 50 µs | 3 ms | |||||
Winbond Electronics | FLASH | 16-SOIC | 3.6 V | 2.7 V | 16 MB | QPI SPI - Quad I/O | FLASH - NOR | Surface Mount | 104 MHz | -40 ¯C | 85 C | 16M x 8 | 16-SOIC | Non-Volatile | 50 µs | 3 ms | 7.5 mm | 0.295 " | |||
Winbond Electronics | FLASH | 24-TBGA | 1.95 V | 1.7 V | 16 MB | SPI - Quad I/O | FLASH - NOR | Surface Mount | 133 MHz | -40 ¯C | 85 C | 16M x 8 | 24-TFBGA (6x8) | Non-Volatile | 3 ms | - | |||||
Winbond Electronics | FLASH | 8-SOIC | 1.95 V | 1.65 V | 16 MB | QPI SPI - Quad I/O | FLASH - NOR | Surface Mount | 104 MHz | -40 ¯C | 85 C | 16M x 8 | 8-SOIC | Non-Volatile | 60 µs | 5 ms | 0.209 in 5.3 mm | ||||
Winbond Electronics | FLASH | 8-WDFN Exposed Pad | 3.6 V | 2.7 V | 16 MB | DTR QPI SPI - Quad I/O | FLASH - NOR | Surface Mount | 133 MHz | -40 °C | 105 °C | 3 ms | 16M x 8 | 8-WSON (8x6) | Non-Volatile |