
LTC2656 Series
Manufacturer: Analog Devices Inc./Maxim Integrated

OCTAL 16-/12-BIT RAIL-TO-RAIL DACS WITH 10PPM/°C MAX REFERENCE
| Part | Output Type | Voltage - Supply, Digital [Max] [custom] | Voltage - Supply, Digital [Min] [custom] | Number of Bits | INL/DNL (LSB) | Operating Temperature [Max] | Operating Temperature [Min] | Differential Output | Package / Case | Package / Case | Data Interface | Mounting Type | Supplier Device Package | Settling Time | Voltage - Supply, Analog [Max] | Voltage - Supply, Analog [Min] | Number of D/A Converters | Reference Type | Voltage - Supply, Analog | Voltage - Supply, Digital [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc./Maxim Integrated | Voltage - Buffered | 5.5 V | 2.7 V | 12 | 0.1 LSB 0.5 LSB | 85 °C | -40 C | 20-TSSOP Exposed Pad | 0.173 " 4.4 mm | SPI | Surface Mount | 20-TSSOP-EP | 4.2 µs | 5.5 V | 2.7 V | 8 | External Internal | |||
Analog Devices Inc./Maxim Integrated | Voltage - Buffered | 5.5 V | 2.7 V | 16 | 0.3 LSB 2 | 70 °C | 0 °C | 20-WFQFN Exposed Pad | SPI | Surface Mount | 20-QFN (4x5) | 8.9 µs | 5.5 V | 2.7 V | 8 | External Internal | ||||
Analog Devices Inc./Maxim Integrated | Voltage - Buffered | 5.5 V | 2.7 V | 16 | 0.3 LSB 2 | 70 °C | 0 °C | 20-TSSOP Exposed Pad | 0.173 " 4.4 mm | SPI | Surface Mount | 20-TSSOP-EP | 8.9 µs | 5.5 V | 2.7 V | 8 | External Internal | |||
Analog Devices Inc./Maxim Integrated | Voltage - Buffered | 16 | 0.3 LSB 2 | 70 °C | 0 °C | 20-WFQFN Exposed Pad | SPI | Surface Mount | 20-QFN (4x5) | 7.9 µs | 8 | External Internal | 5 V | 5 V | ||||||
Analog Devices Inc./Maxim Integrated | Voltage - Buffered | 16 | 0.3 LSB 2 | 85 °C | -40 C | 20-WFQFN Exposed Pad | SPI | Surface Mount | 20-QFN (4x5) | 7.9 µs | 8 | External Internal | 5 V | 5 V | ||||||
Analog Devices Inc./Maxim Integrated | Voltage - Buffered | 5.5 V | 2.7 V | 16 | 0.3 LSB 2 | 85 °C | -40 C | 20-TSSOP Exposed Pad | 0.173 " 4.4 mm | SPI | Surface Mount | 20-TSSOP-EP | 8.9 µs | 5.5 V | 2.7 V | 8 | External Internal | |||
Analog Devices Inc./Maxim Integrated | Voltage - Buffered | 12 | 0.1 LSB 0.5 LSB | 85 °C | -40 C | 20-WFQFN Exposed Pad | SPI | Surface Mount | 20-QFN (4x5) | 4.6 µs | 8 | External Internal | 5 V | 5 V | ||||||
Analog Devices Inc./Maxim Integrated | Voltage - Buffered | 12 | 0.1 LSB 0.5 LSB | 70 °C | 0 °C | 20-TSSOP Exposed Pad | 0.173 " 4.4 mm | SPI | Surface Mount | 20-TSSOP-EP | 4.6 µs | 8 | External Internal | 5 V | 5 V | |||||
Analog Devices Inc./Maxim Integrated | Voltage - Buffered | 5.5 V | 2.7 V | 16 | 0.3 LSB 2 | 85 °C | -40 C | 20-WFQFN Exposed Pad | SPI | Surface Mount | 20-QFN (4x5) | 8.9 µs | 5.5 V | 2.7 V | 8 | External Internal | ||||
Analog Devices Inc./Maxim Integrated | Voltage - Buffered | 16 | 0.3 LSB 2 | 85 °C | -40 C | 20-WFQFN Exposed Pad | SPI | Surface Mount | 20-QFN (4x5) | 7.9 µs | 8 | External Internal | 5 V | 5 V |