TWL1200-Q1 Series

Automotive Catalog SDIO, UART, and Audio Voltage-Translation Transceiver

Catalog

Automotive Catalog SDIO, UART, and Audio Voltage-Translation Transceiver

Part	Voltage - VCCA [Max]	Voltage - VCCA [Min]	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Number of Circuits	Channels per Circuit	Output Type	Data Rate	Voltage - VCCB [Max]	Voltage - VCCB [Min]	Package / Case	Channel Type	Supplier Device Package	Translator Type	Features	Qualification	Grade
Texas Instruments TWL1200YFFR	3.6 V	1.1 V	85 °C	-40 °C	Surface Mount	1	4	Open Drain	60 Mbps	3.6 V	1.1 V	49-UFBGA DSBGA	Bidirectional	49-DSBGA (2.8x2.8)	Voltage Level	Audio SIM Card Interface UART
Texas Instruments TWL1200ZQCR	3.6 V	1.1 V	85 °C	-40 °C	Surface Mount	1	4	Open Drain	60 Mbps	3.6 V	1.1 V	48-VFBGA	Bidirectional	48-BGA MICROSTAR JUNIOR (4x4)	Voltage Level	Audio SIM Card Interface UART
Texas Instruments TWL1200IPFBRQ1	3.6 V	1.1 V	85 °C	-40 °C	Surface Mount	1	4	Open Drain	60 Mbps	3.6 V	1.1 V	48-TQFP	Bidirectional	48-TQFP (7x7)	Voltage Level	Audio SIM Card Interface UART	AEC-Q100	Automotive

Catalog

Automotive Catalog SDIO, UART, and Audio Voltage-Translation Transceiver

Key Features

• Qualified for Automotive ApplicationsAEC-Q100 Test Guidance With the Following Results:Device Temperature Grade 3: –40°C to +85°CAmbient Operating Temperature RangeDevice HBM ESD Classification Level H1CDevice CDM ESD Classification Level C3BLevel TranslatorVCCAand VCCBRange of 1.1 V to 3.6 VSeamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility GapBetween 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)Latch-Up Performance Exceeds 100 mA per JESD 78, Class IIQualified for Automotive ApplicationsAEC-Q100 Test Guidance With the Following Results:Device Temperature Grade 3: –40°C to +85°CAmbient Operating Temperature RangeDevice HBM ESD Classification Level H1CDevice CDM ESD Classification Level C3BLevel TranslatorVCCAand VCCBRange of 1.1 V to 3.6 VSeamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility GapBetween 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)Latch-Up Performance Exceeds 100 mA per JESD 78, Class II

Description

The TWL1200-Q1 is a 19-bit voltage translator specifically designed to bridge seamlessly the 1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). The device is optimized for SDIO, UART, and audio functions. The TWL1200-Q1 has two supply-voltage pins, VCCAand VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200-Q1 enables system designers easily to interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards. The TWL1200-Q1 is offered in a thin quad flat pack [TQFP (PFB)] package. Low static power consumption and small package size make the TWL1200-Q1 an ideal choice for mobile-phone applications. The TWL1200-Q1 is a 19-bit voltage translator specifically designed to bridge seamlessly the 1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). The device is optimized for SDIO, UART, and audio functions. The TWL1200-Q1 has two supply-voltage pins, VCCAand VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200-Q1 enables system designers easily to interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards. The TWL1200-Q1 is offered in a thin quad flat pack [TQFP (PFB)] package. Low static power consumption and small package size make the TWL1200-Q1 an ideal choice for mobile-phone applications.