ESD7551 Series

ESD Protection, Micro−Packaged Diodes

Catalog

ESD Protection, Micro−Packaged Diodes

Part	Operating Temperature [Min]	Operating Temperature [Max]	Voltage - Clamping (Max) @ Ipp [Max]	Package / Case	Voltage - Breakdown (Min) [Min]	Applications	Capacitance @ Frequency	Power Line Protection	Bidirectional Channels [custom]	Supplier Device Package	Supplier Device Package [y]	Supplier Device Package [x]	Voltage - Reverse Standoff (Typ)	Type	Mounting Type
ON Semiconductor ESD7551N2T5G	-55 °C	150 °C	13 V	2-XDFN	5 V	General Purpose	0.25 pF		1	2-X2DFN	0.6	1	3.3 V	Zener	Surface Mount

Catalog

ESD Protection, Micro−Packaged Diodes

Key Features

• Ultra−Low Capacitance (0.35 pF Max)

• Low Clamping Voltage

• Low Leakage: <1µA

• Response Time is < 1 ns

• Low Dynamic Resistance < 1 Ω

• SZ Prefix for Automotive and Other Applications Requiring UniqueSite and Control Change Requirements; AEC−Q101 Qualified andPPAP Capable

• IEC61000−4−2 Level 4 ESD Protection

• Stand−off Voltage: 3.3 V

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliant

• SZESD7551MXWT5G Wettable Flank Package

Description

The ESD7551 is designed to protect voltage sensitive components that require ultra−low capacitance from ESD and transient voltage events. Excellent clamping capability, low capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its low capacitance, the part is well suited for use in high frequency designs such as USB 2.0 high speed and antenna line applications.