SMDAL Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
ALUMINUM SOLDER PASTE WATER-SOLU
| Part | Type | Mesh Type | Melting Point | Melting Point | Flux Type | Shelf Life | Composition | Shelf Life Start | Form | Form | Form |
|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | Solder Paste | 3 | 430 °F | 221 °C | Water Soluble | 12 Months | Sn96.5Ag3.5 (96.5/3.5) | Date of Manufacture | 7.05 oz | 200 g | Jar |