1571586 Series
Manufacturer: TE Connectivity AMP Connectors
CONN IC DIP SOCKET 64POS GOLD
| Part | Material Flammability Rating | Contact Resistance | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Mounting Type | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Housing Material | Contact Material - Mating | Type | Type | Type | Features | Termination | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [y] | Type [custom] | Type [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors | UL94 V-0 | 10 mOhm | 0.125 in | 3.18 mm | 0.1 in | 2.54 mm | Through Hole | Gold | 0.63 µm | 25 µin | Copper | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Beryllium Copper | DIP | 22.86 mm | 0.9 in | Open Frame | Solder | 0.1 " | 2.54 mm | Gold | -55 C | 105 ░C | 2 | 64 | 32 | ||||
TE Connectivity AMP Connectors | UL94 V-0 | 10 mOhm | 0.125 in | 3.18 mm | 0.1 in | 2.54 mm | Through Hole | Gold | 0.63 µm | 25 µin | Copper | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Beryllium Copper | DIP | Open Frame | Solder | 0.1 " | 2.54 mm | Gold | -55 C | 105 ░C | 12 | 24 | 2 | 15.24 mm | 0.6 in | ||||
TE Connectivity AMP Connectors | UL94 V-0 | 10 mOhm | 0.125 in | 3.18 mm | 0.1 in | 2.54 mm | Through Hole | Gold | 0.63 µm | 25 µin | Copper | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Beryllium Copper | DIP | 7.62 mm | 0.3 in | Open Frame | Solder | 0.1 " | 2.54 mm | Gold | -55 C | 105 ░C | 16 | 2 | 8 | ||||
TE Connectivity AMP Connectors | UL94 V-0 | 10 mOhm | 0.125 in | 3.18 mm | 0.1 in | 2.54 mm | Through Hole | Gold | 0.63 µm | 25 µin | Copper | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Beryllium Copper | DIP | Open Frame | Solder | 0.1 " | 2.54 mm | Gold | -55 C | 105 ░C | 40 | 15.24 mm | 0.6 in |