222 Series

Catalog

IC & COMPONENT SOCKET, 22 CONTACTS, DIP SOCKET, 2.54 MM, 222 SERIES, 10.16 MM, BERYLLIUM COPPER

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Material - Post	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Features	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Type	Type	Type	Contact Finish - Mating	Mounting Type	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Contact Finish - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Number of Pins	Termination Post Length
3M Electronic Specialty 222-3343-00-0602J	UL94 V-0	0.11 in	2.78 mm	1 A	Beryllium Copper	0.1 "	2.54 mm	11	22	2	Closed Frame	Polysulfone (PSU) Glass Filled	30 µin	0.76 µm	Press-Fit	10.16 mm	DIP ZIF (ZIP)	0.4 in	Gold	Connector	Beryllium Copper	0.76 Ám	30 Áin	-55 C	125 °C	0.1 in	2.54 mm	Gold
3M Electronic Specialty 222-3343-09-0602J	UL94 V-0	0.13 in	3.3 mm	1 A	Beryllium Copper	0.1 "	2.54 mm				Closed Frame	Polysulfone (PSU) Glass Filled	30 µin	0.76 µm	Solder				Gold	Through Hole	Beryllium Copper	0.76 Ám	30 Áin	-55 C	125 °C	0.1 in	2.54 mm	Gold	10.16 mm	0.4 in	DIP	DIP	10.16 mm	0.4 "	22
3M Electronic Specialty 222-3343-19-0602J	UL94 V-0		0.62 in	1 A	Beryllium Copper	0.1 "	2.54 mm				Closed Frame	Polysulfone (PSU) Glass Filled	30 µin	0.76 µm	Wire Wrap				Gold	Through Hole	Beryllium Copper	0.76 Ám	30 Áin	-55 C	125 °C	0.1 in	2.54 mm	Gold	10.16 mm	0.4 in	DIP	DIP	10.16 mm	0.4 "	22	15.75 mm