SPHWW1 Series
Manufacturer: Samsung Semiconductor, Inc.
LED COB LC013B GEN3 WHT SQ 2700K
| Part | CRI (Color Rendering Index) | Configuration | Height [z] | Voltage - Forward (Vf) (Typ) | Light Emitting Surface (LES) [diameter] | Luminous Flux @ Current/Temperature | Temperature - Test | Lumens/Watt @ Current - Test | Color | Lens Type | Type | Current - Test | Current - Max [Max] | Viewing Angle | CCT (K) | CCT (K) | Size / Dimension [y] | Size / Dimension [x] | Luminous Flux @ Current/Temperature [Max] | Luminous Flux @ Current/Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung Semiconductor, Inc. | 80 | Square | 1.6 mm | 35.5 V | 11 mm | 1969 lm | 25 °C | 154 lm/W | Warm White | Flat | Chip On Board (COB) | 360 mA | 660 mA | 115 ° | 2700 K | 3-Step MacAdam Ellipse | ||||
Samsung Semiconductor, Inc. | 80 | Square | 1.5 mm | 35.5 V | 17 mm | 25 °C | 153 lm/W | Warm White | Flat | Chip On Board (COB) | 1.08 A | 1.9 A | 115 ° | 2700 K | 2-Step MacAdam Ellipse | 21.5 mm | 21.5 mm | |||
Samsung Semiconductor, Inc. | 80 | Square | 1.5 mm | 35.5 V | 17 mm | 25 °C | Warm White | Flat | Chip On Board (COB) | 720 mA | 1.3 A | 115 ° | 3500 K | 3-Step MacAdam Ellipse | 21.5 mm | 21.5 mm | 4408 lm | 3880 lm | ||
Samsung Semiconductor, Inc. | 90 | Square | 1.5 mm | 35.5 V | 12.4 mm | 2325 lm | 25 °C | 121 lm/W | Warm White | Flat | Chip On Board (COB) | 540 mA | 980 mA | 115 ° | 2700 K | 2-Step MacAdam Ellipse | ||||
Samsung Semiconductor, Inc. | 95 | Square | 1.5 mm | 35.5 V | 17 mm | 3371 lm | 25 °C | 106 lm/W | Warm White | Flat | Chip On Board (COB) | 900 mA | 1.62 A | 115 ° | 3500 K | 3-Step MacAdam Ellipse | 21.5 mm | 21.5 mm | 3708 lm | 3034 lm |
Samsung Semiconductor, Inc. | 95 | Square | 1.5 mm | 35.5 V | 17 mm | 2712 lm | 25 °C | 106 lm/W | Warm White | Flat | Chip On Board (COB) | 720 mA | 1.3 A | 115 ° | 3500 K | 21.5 mm | 21.5 mm | |||
Samsung Semiconductor, Inc. | 90 | Square | 1.5 mm | 35.5 V | 17 mm | 3402 lm | 25 °C | 133 lm/W | Warm White | Flat | Chip On Board (COB) | 720 mA | 1.3 A | 115 ° | 3500 K | 3-Step MacAdam Ellipse | 21.5 mm | 21.5 mm | 3848 lm | 2955 lm |
Samsung Semiconductor, Inc. | 90 | Square | 1.6 mm | 35.5 V | 11 mm | 1538 lm | 25 °C | 120 lm/W | Warm White | Flat | Chip On Board (COB) | 360 mA | 660 mA | 115 ° | 2700 K | 2-Step MacAdam Ellipse | ||||
Samsung Semiconductor, Inc. | 90 | Square | 1.5 mm | 35.5 V | 17 mm | 4163 lm | 25 °C | 130 lm/W | Neutral White | Flat | Chip On Board (COB) | 900 mA | 1.62 A | 115 ° | 4000 K | 2-Step MacAdam Ellipse | 21.5 mm | 21.5 mm | 4511 lm | 3815 lm |
Samsung Semiconductor, Inc. | 80 | Square | 1.5 mm | 35.5 V | 17 mm | 5117 lm | 25 °C | 160 lm/W | Neutral White | Flat | Chip On Board (COB) | 900 mA | 1.62 A | 115 ° | 4000 K | 2-Step MacAdam Ellipse | 21.5 mm | 21.5 mm | 5487 lm | 4747 lm |