W25Q256 Series
Manufacturer: Winbond Electronics
IC FLASH 256MBIT SPI 24TFBGA
| Part | Memory Organization | Technology | Supplier Device Package | Memory Format | Memory Interface | Memory Type | Voltage - Supply [Max] | Voltage - Supply [Min] | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Memory Size | Clock Frequency | Package / Case | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page | Package / Case | Package / Case | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 32 M | FLASH - NOR | 24-TFBGA (6x8) | FLASH | QPI SPI - Quad I/O | Non-Volatile | 3.6 V | 2.7 V | Surface Mount | -40 °C | 105 °C | 256 Gbit | 104 MHz | 24-TBGA | 50 µs | 3 ms | ||||
Winbond Electronics | 32 M | FLASH - NOR | 16-SOIC | FLASH | SPI - Quad I/O | Non-Volatile | 3.6 V | 2.7 V | Surface Mount | -40 °C | 105 °C | 256 Gbit | 133 MHz | 16-SOIC | 3 ms | 7.5 mm | 0.295 " | |||
Winbond Electronics | 32 M | FLASH - NOR | 8-WSON (8x6) | FLASH | QPI SPI - Quad I/O | Non-Volatile | 3.6 V | 2.7 V | Surface Mount | -40 ¯C | 85 C | 256 Gbit | 104 MHz | 8-WDFN Exposed Pad | 50 µs | 3 ms | ||||
Winbond Electronics | 32 M | FLASH - NOR | 8-WFLGA (6x5) | FLASH | SPI - Quad I/O | Non-Volatile | 3.6 V | 2.7 V | Surface Mount | -40 ¯C | 85 C | 256 Gbit | 133 MHz | 8-WLGA Exposed Pad | 3 ms | 6 ns | ||||
Winbond Electronics | 32 M | FLASH - NOR | 24-TFBGA (6x8) | FLASH | QPI SPI - Quad I/O | Non-Volatile | 3.6 V | 2.7 V | Surface Mount | -40 ¯C | 85 C | 256 Gbit | 104 MHz | 24-TBGA | 50 µs | 3 ms | ||||
Winbond Electronics | 32 M | FLASH - NOR | 24-TFBGA (6x8) | FLASH | SPI - Quad I/O | Non-Volatile | 3.6 V | 2.7 V | Surface Mount | -40 °C | 105 °C | 256 Gbit | 133 MHz | 24-TBGA | 3 ms | |||||
Winbond Electronics | 32 M | FLASH - NOR | 8-WSON (8x6) | FLASH | QPI SPI - Quad I/O | Non-Volatile | 3.6 V | 2.7 V | Surface Mount | -40 ¯C | 85 C | 256 Gbit | 104 MHz | 8-WDFN Exposed Pad | 50 µs | 3 ms | ||||
Winbond Electronics | 32 M | FLASH - NOR | 8-WSON (8x6) | FLASH | SPI - Quad I/O | Non-Volatile | 3.6 V | 2.7 V | Surface Mount | -40 °C | 105 °C | 256 Gbit | 133 MHz | 8-WDFN Exposed Pad | 3 ms | |||||
Winbond Electronics | 32 M | FLASH - NOR | 24-TFBGA (6x8) | FLASH | QPI SPI - Quad I/O | Non-Volatile | 3.6 V | 2.7 V | Surface Mount | -40 ¯C | 85 C | 256 Gbit | 104 MHz | 24-TBGA | 50 µs | 3 ms | ||||
Winbond Electronics | 32 M | FLASH - NOR | 16-SOIC | FLASH | QPI SPI - Quad I/O | Non-Volatile | 3.6 V | 2.7 V | Surface Mount | -40 ¯C | 85 C | 256 Gbit | 104 MHz | 16-SOIC | 50 µs | 3 ms | 7.5 mm | 0.295 " |