10018784 Series
Manufacturer: Amphenol ICC (FCI)
Beta
⌘K
CONN PCI EXP FMALE 164POS 0.039
| Part | Material - Insulation | Card Type | Features | Pitch | Pitch | Contact Finish Thickness | Number of Rows [custom] | Contact Finish | Termination | Gender | Card Thickness | Card Thickness | Number of Positions | Contact Type | Operating Temperature [Min] | Operating Temperature [Max] | Read Out | Mounting Type | Contact Material | Color | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | PCI Express™ | Board Guide Locking Ramp | 1 mm | 0.039 in | Flash | 2 | Gold | Solder Staggered | Female | 1.57 mm | 0.062 in | 164 | Cantilever | -55 C | 85 °C | Dual | Through Hole | Copper Alloy | Black | ||||
 Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | PCI Express™ | Board Guide Locking Ramp | 1 mm | 0.039 in | 2 | Gold | Solder Staggered | Female | 1.57 mm | 0.062 in | 64 | Cantilever | -55 C | 85 °C | Dual | Through Hole | Copper Alloy | Black | 21 | 11 | 30 Áin | 0.76 Ám | |
 Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | PCI Express™ | Board Lock Locking Ramp | 1 mm | 0.039 in | 2 | Gold | Solder Staggered | Female | 1.57 mm | 0.062 in | 164 | Cantilever | -55 C | 85 °C | Dual | Through Hole | Copper Alloy | Black | 15 µin | 0.38 µm | |||
 Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | PCI Express™ | Board Guide Locking Ramp | 1 mm | 0.039 in | 2 | Gold | Solder Staggered | Female | 1.57 mm | 0.062 in | 164 | Cantilever | -55 C | 85 °C | Dual | Through Hole | Copper Alloy | Black | 30 Áin | 0.76 Ám | |||
 Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | PCI Express™ | Board Guide Locking Ramp | 1 mm | 0.039 in | Flash | 2 | Gold Gold GXT™ | Solder Staggered | Female | 1.57 mm | 0.062 in | 98 | -55 C | 85 °C | Dual | Through Hole | Copper Alloy | Black | |||||
 Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | PCI Express™ | Board Guide Locking Ramp | 1 mm | 0.039 in | 2 | Gold | Solder Staggered | Female | 1.57 mm | 0.062 in | 64 | Cantilever | -55 C | 85 °C | Dual | Through Hole | Copper Alloy | Black | 21 | 11 | 15 µin | 0.38 µm | |
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | PCI Express™ | Board Guide Locking Ramp | 1 mm | 0.039 in | 2 | Gold Gold GXT™ | Solder Staggered | Female | 1.57 mm | 0.062 in | 98 | -55 C | 85 °C | Dual | Through Hole | Copper Alloy | White | 15 µin | 0.38 µm | ||||
 Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | PCI Express™ | Board Guide Locking Ramp | 1 mm | 0.039 in | Flash | 2 | Gold | Solder | Female | 1.57 mm | 0.062 in | 98 | Cantilever | -55 C | 85 °C | Dual | Through Hole | Copper Alloy | Black | ||||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | PCI Express™ | Board Lock Locking Ramp | 1 mm | 0.039 in | 2 | Gold | Solder Staggered | Female | 1.57 mm | 0.062 in | 36 | Cantilever | -55 C | 85 °C | Dual | Through Hole | Copper Alloy | Black | 30 Áin | 0.76 Ám | |||
 Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | PCI Express™ | Board Guide Locking Ramp | 1 mm | 0.039 in | 2 | Gold | Solder | Female | 1.57 mm | 0.062 in | 98 | Cantilever | -55 C | 85 °C | Dual | Through Hole | Copper Alloy | Black | 15 µin | 0.38 µm |