248 Series

Catalog

IC & COMPONENT SOCKET, 48 CONTACTS, QFN TEST SOCKET, 0.5 MM, 248 SERIES, BERYLLIUM COPPER

Part	Termination Post Length	Termination Post Length	Contact Resistance	Mounting Type	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Mating	Pitch - Mating	Termination	Features	Contact Finish - Post	Housing Material	Contact Material - Post	Contact Material - Mating	Type	Operating Temperature [Min]	Operating Temperature [Max]	Material Flammability Rating	Termination Post Length	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Pins	Pitch - Post	Pitch - Post	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)
3M Electronic Specialty 248-5205-01	3 mm	0.118 in	25 mOhm	Through Hole	Gold	12	48	4	0.5 mm	0.02 in	Solder	Closed Frame	Gold	Polyethersulfone (PES)	Beryllium Copper	Beryllium Copper	QFN
3M Electronic Specialty 248-1282-19-0602J	0.62 in			Through Hole	Gold				2.54 mm	0.1 "	Wire Wrap	Closed Frame	Gold	Polysulfone (PSU) Glass Filled	Beryllium Copper	Beryllium Copper		-55 C	125 °C	UL94 V-0	15.75 mm	1 A	0.76 Ám	30 Áin	30 µin	0.76 µm	48	0.1 in	2.54 mm	15.24 mm	DIP	0.6 in	15.24 mm	0.6 in	DIP
3M Electronic Specialty 248-1282-29-0602J	3.3 mm	0.13 in		Through Hole	Gold				2.54 mm	0.1 "	Solder	Closed Frame	Gold	Polysulfone (PSU) Glass Filled	Beryllium Copper	Beryllium Copper		-55 C	125 °C	UL94 V-0		1 A	0.76 Ám	30 Áin	30 µin	0.76 µm	48	0.1 in	2.54 mm	15.24 mm	DIP	0.6 in	15.24 mm	0.6 in	DIP
3M Electronic Specialty 248-5205-00	3 mm	0.118 in	25 mOhm	Through Hole	Gold	12	48	4	0.5 mm	0.02 in	Solder	Closed Frame	Gold	Polyethersulfone (PES)	Beryllium Copper	Beryllium Copper	QFN
3M Electronic Specialty 248-1282-09-0602J	3.3 mm	0.13 in		Through Hole	Gold				2.54 mm	0.1 "	Solder	Closed Frame	Gold	Polysulfone (PSU) Glass Filled	Beryllium Copper	Beryllium Copper		-55 C	125 °C	UL94 V-0		1 A	0.76 Ám	30 Áin	30 µin	0.76 µm	48	0.1 in	2.54 mm	15.24 mm	DIP	0.6 in	15.24 mm	0.6 in	DIP