TPS84610 Series

2.95-V to 6-V Input, 6-A synchronous buck, integrated power solution

Catalog

2.95-V to 6-V Input, 6-A synchronous buck, integrated power solution

Part	Size / Dimension [y]	Size / Dimension [z]	Size / Dimension [z]	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [x]	Number of Outputs	Features	Mounting Type	Type	Current - Output (Max) [Max]	Control Features	Package / Case	Voltage - Input (Min) [Min]	Voltage - Output 1 [Min]	Voltage - Output 1 [Max]	Voltage - Input (Max) [Max]	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Applications	Efficiency
Texas Instruments TPS84610RKGT	9 mm	0.11 in	2.8 mm	0.43 "	0.35 "	11 mm	1	UVLO	Surface Mount	Non-Isolated PoL Module	6 A	Active High Enable	39-BQFN Exposed Pad	2.95 V	0.8 V	3.6 V	6 V	39-B1QFN (11x9)	85 °C	-40 °C	ITE (Commercial)	96 %
Texas Instruments TPS84610RKGR	9 mm	0.11 in	2.8 mm	0.43 "	0.35 "	11 mm	1	UVLO	Surface Mount	Non-Isolated PoL Module	6 A	Active High Enable	39-BQFN Exposed Pad	2.95 V	0.8 V	3.6 V	6 V	39-B1QFN (11x9)	85 °C	-40 °C	ITE (Commercial)	96 %

Catalog

2.95-V to 6-V Input, 6-A synchronous buck, integrated power solution

Key Features

• Complete Integrated Power Solution AllowsSmall Footprint, Low-Profile DesignEfficiencies Up To 96%Wide-Output Voltage Adjust0.8 V to 3.6 V, with ±1% Reference AccuracyAdjustable Switching Frequency(500 kHz to 2 MHz)Synchronizes to an External ClockAdjustable Slow-StartOutput Voltage Sequencing / TrackingPower Good OutputProgrammable Undervoltage Lockout (UVLO)Output Overcurrent ProtectionOver Temperature ProtectionOperating Temperature Range: –40°C to 85°CEnhanced Thermal Performance: 12°C/WMeets EN55022 Class B EmissionsFor Design Help Including SwitcherPro™ visithttp://www.ti.com/TPS84610Complete Integrated Power Solution AllowsSmall Footprint, Low-Profile DesignEfficiencies Up To 96%Wide-Output Voltage Adjust0.8 V to 3.6 V, with ±1% Reference AccuracyAdjustable Switching Frequency(500 kHz to 2 MHz)Synchronizes to an External ClockAdjustable Slow-StartOutput Voltage Sequencing / TrackingPower Good OutputProgrammable Undervoltage Lockout (UVLO)Output Overcurrent ProtectionOver Temperature ProtectionOperating Temperature Range: –40°C to 85°CEnhanced Thermal Performance: 12°C/WMeets EN55022 Class B EmissionsFor Design Help Including SwitcherPro™ visithttp://www.ti.com/TPS84610

Description

The TPS84610RKG is an easy-to-use integrated power solution that combines a 6-A DC/DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process. The 9×11×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow. The TPS84610 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques. The TPS84610RKG is an easy-to-use integrated power solution that combines a 6-A DC/DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process. The 9×11×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow. The TPS84610 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.