573300 Series
Manufacturer: Boyd Laconia, LLC
Beta
⌘K
HEAT SINK PASSIVE TO-263 18 C/W MATTE TIN ROHS COMPLIANT: YES
| Part | Material | Thermal Resistance @ Forced Air Flow | Material Finish | Type | Power Dissipation @ Temperature Rise | Attachment Method | Fin Height [z] | Fin Height [z] | Width | Width | Shape [custom] | Shape [custom] | Package Cooled | Length | Length | Thermal Resistance @ Natural |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Boyd Laconia, LLC | Aluminum | 8 °C/W | Tin | Top Mount | 1.3 W | SMD Pad | 0.4 in | 10.16 mm | 1.03 " | 26.16 mm | Rectangular | Fins | TO-263 (D²PAK) | 12.7 mm | 0.5 in | 18 °C/W |