M50-360 Series
Manufacturer: Harwin Inc.
CONN HEADER SMD 50POS 1.27MM
| Part | Mated Stacking Heights | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions Loaded | Row Spacing - Mating | Row Spacing - Mating | Contact Length - Mating | Contact Length - Mating | Style | Number of Positions | Mounting Type | Shrouding | Contact Shape | Material Flammability Rating | Fastening Type | Contact Type | Insulation Material | Connector Type | Termination | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Contact Material | Number of Rows [custom] | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Insulation Height [z] | Insulation Height [z] | Insulation Color | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Harwin Inc. | 3.9 mm 5.3 mm 6.08 mm 6.18 mm 7 mm | 2.5 µm | 98.4 µin | All | 0.05 in | 1.27 mm | 3 mm | 0.118 in | Board to Board Cable | 50 | Surface Mount | Unshrouded | Square | UL94 V-0 | Push-Pull | Male Pin | Thermoplastic | Header | Solder | 1.27 mm | 0.05 in | Gold | Copper Alloy | 2 | -40 C | 105 ░C | Tin | 1 mm | 0.039 in | Black | 0.076 µm | 3 µin | |||
Harwin Inc. | All | 0.05 in | 1.27 mm | 3 mm | 0.118 in | Board to Board Cable | 12 | Surface Mount Through Hole | Unshrouded | Square | UL94 V-0 | Push-Pull | Male Pin | Thermoplastic | Header | Solder | 1.27 mm 2 mm | 0.05 in 0.079 " | Gold | Copper Alloy | 2 | -55 C -40 C | 105 ░C 125 °C | Tin | 1 mm | 0.039 in | Black | 0.076 µm | 3 µin | 0.1 in | 2.54 mm | Pick and Place | |||
Harwin Inc. | 3.9 mm 5.3 mm 6.08 mm 6.18 mm 7 mm | 2.5 µm | 98.4 µin | All | 0.05 in | 1.27 mm | 3 mm | 0.118 in | Board to Board Cable | 40 | Surface Mount | Unshrouded | Square | UL94 V-0 | Push-Pull | Male Pin | Thermoplastic | Header | Solder | 1.27 mm | 0.05 in | Gold | Copper Alloy | 2 | -40 C | 105 ░C | Tin | 1 mm | 0.039 in | Black | 0.076 µm | 3 µin | |||
Harwin Inc. | 3.9 mm 5.3 mm 6.08 mm 6.18 mm 7 mm | 2.5 µm | 98.4 µin | All | 0.05 in | 1.27 mm | 3 mm | 0.118 in | Board to Board Cable | 10 | Surface Mount | Unshrouded | Square | UL94 V-0 | Push-Pull | Male Pin | Thermoplastic | Header | Solder | 1.27 mm | 0.05 in | Gold | Copper Alloy | 2 | -40 C | 105 ░C | Tin | 1 mm | 0.039 in | Black | 0.076 µm | 3 µin | |||
Harwin Inc. | 3.9 mm 5.3 mm 6.08 mm 6.18 mm 7 mm | 2.5 µm | 98.4 µin | All | 0.05 in | 1.27 mm | 3 mm | 0.118 in | Board to Board Cable | 20 | Surface Mount | Unshrouded | Square | UL94 V-0 | Push-Pull | Male Pin | Thermoplastic | Header | Solder | 1.27 mm | 0.05 in | Gold | Copper Alloy | 2 | -40 C | 105 ░C | Tin | 1 mm | 0.039 in | Black | 0.076 µm | 3 µin | Pick and Place | ||
Harwin Inc. | 3.9 mm 5.3 mm 6.08 mm 6.18 mm | 2.5 µm | 98.4 µin | All | 0.05 in | 1.27 mm | 3 mm | 0.118 in | Board to Board Cable | 50 | Surface Mount | Unshrouded | Square | UL94 V-0 | Push-Pull | Male Pin | Thermoplastic | Header | Solder | 1.27 mm | 0.05 in | Gold | Copper Alloy | 2 | -40 C | 105 ░C | Tin | 1 mm | 0.039 in | Black | 0.076 µm 0.08 µm | 3 µin 3.15 µin | Board Guide Pick and Place |