BDN16 Series
Manufacturer: CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.61"SQ
| Part | Shelf Life | Package Cooled | Fin Height [custom] | Fin Height | Shape | Width [x] | Width [x] | Length [x] | Length [x] | Type | Material | Thermal Resistance @ Forced Air Flow | Attachment Method | Thermal Resistance @ Natural | Material Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products | 24 Months | ASIC BGA CPU LGA | 0.355 in | 9.02 mm | Pin Fins Square | 40.89 mm | 1.61 in | 1.61 in | 40.89 mm | Top Mount | Aluminum | 4.5 °C/W | Thermal Tape Adhesive (Included) | 13.5 °C/W | Black Anodized |