BDN11 Series
Manufacturer: CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.11"SQ
| Part | Shelf Life | Material | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Type | Fin Height [custom] | Fin Height | Attachment Method | Package Cooled | Shape | Width [x] | Width [x] | Length | Length | Material Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products | 24 Months | Aluminum | 7.2 °C/W | 20.9 °C/W | Top Mount | 0.355 in | 9.02 mm | Thermal Tape Adhesive (Included) | ASIC BGA CPU LGA | Pin Fins Square | 28.19 mm | 1.11 in | 28.19 mm | 1.11 in | Black Anodized |