SP1013-01WTG Series

1CH 30pF 30kV TVS Diode Array Flipchip

Manufacturer: Littelfuse/Commercial Vehicle Products

Catalog

1CH 30pF 30kV TVS Diode Array Flipchip

Part	Voltage - Breakdown (Min) [Min]	Mounting Type	Bidirectional Channels [custom]	Operating Temperature [Min]	Operating Temperature [Max]	Applications	Power Line Protection	Package / Case	Package / Case	Type	Voltage - Clamping (Max) @ Ipp [Max]	Voltage - Reverse Standoff (Typ)	Supplier Device Package	Capacitance @ Frequency
Littelfuse/Commercial Vehicle Products SP1013-01WTG	7 V	Surface Mount	1	-40 °C	125 ¯C	General Purpose		0603 Metric	0201	Zener	9.5 V	5 V	2-FlipChip	30 pF

Catalog

1CH 30pF 30kV TVS Diode Array Flipchip

Key Features

• ESD IEC61000-4-2,±30kV contact, ±30kV air

• EFT, IEC61000-4-4, 40A (5/50ns)

• Lightning, IEC61000-4-5, 8A (tP=8/20μs)

• Low capacitance of 30pF (@ VR=0V)

• Low leakage current of 0.1μA at 5V

• Industries smallest, manufacturable ESD footprint (True 0201)

Description

The SP1013 includes back-to-back Zener diodes that provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). It measures 0.52 x 0.27mm making it a true 0201 footprint or about 30% smaller than existing 0201 ESD footprints. The SP1013 can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation, and the back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present.