IL-WX-16 Series
Manufacturer: JAE Electronics
CONN RCPT 16POS 0.031 TIN SMD
| Part | Contact Material | Applications | Insulation Material | Contact Shape | Pitch - Mating | Pitch - Mating | Number of Rows [custom] | Mounting Type | Number of Positions Loaded | Insulation Height | Insulation Height | Features | Current Rating (Amps) | Number of Positions | Contact Type | Operating Temperature [Max] | Operating Temperature [Min] | Termination | Fastening Type | Insulation Color | Material Flammability Rating | Connector Type | Row Spacing - Mating | Row Spacing - Mating | Contact Length - Mating | Contact Length - Mating | Contact Finish - Post | Insulation Height [z] | Insulation Height [z] | Shrouding | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
JAE Electronics | Copper Alloy | General Purpose | Polyphenylene Sulfide (PPS) Glass Filled | Square | 0.8 mm | 0.031 in | 2 | Surface Mount | All | 0.128 in | 3.25 mm | Board Guide Solder Retention | 0.5 A | 16 | Forked | 85 °C | -40 C | Solder | Push-Pull | Black | UL94 V-0 | Receptacle | 0.059 in | 1.5 mm | |||||||
JAE Electronics | Copper Alloy | Polyphenylene Sulfide (PPS) Glass Filled | Square | 0.8 mm | 0.031 in | 2 | Right Angle Surface Mount | All | Solder Retention | 500 mA | 16 | Male Pin | 85 °C | -40 C | Solder | Push-Pull | Black | Header | 0.059 in | 1.5 mm | 1.8 mm | 0.071 in | Tin | 0.185 in | 4.7 mm | Shrouded - 4 Wall | |||||
JAE Electronics | Copper Alloy | General Purpose | Polyphenylene Sulfide (PPS) Glass Filled | Square | 0.8 mm | 0.031 in | 2 | Surface Mount | All | 0.128 in | 3.25 mm | Solder Retention | 0.5 A | 16 | Forked | 85 °C | -40 C | Solder | Push-Pull | Black | UL94 V-0 | Receptacle | 0.059 in | 1.5 mm | |||||||
JAE Electronics | Copper Alloy | Polyphenylene Sulfide (PPS) Glass Filled | Square | 0.8 mm | 0.031 in | 2 | Right Angle Surface Mount | All | Board Guide Solder Retention | 500 mA | 16 | Male Pin | 85 °C | -40 C | Solder | Push-Pull | Black | Header | 0.059 in | 1.5 mm | 1.8 mm | 0.071 in | Tin | 0.185 in | 4.7 mm | Shrouded - 4 Wall | |||||
JAE Electronics | Copper Alloy | General Purpose | Polyphenylene Sulfide (PPS) Glass Filled | Square | 0.8 mm | 0.031 in | 2 | Surface Mount | All | 0.128 in | 3.25 mm | Solder Retention | 0.5 A | 16 | Forked | 85 °C | -40 C | Solder | Push-Pull | Black | UL94 V-0 | Receptacle | 0.059 in | 1.5 mm | |||||||
JAE Electronics | Copper Alloy | Polyphenylene Sulfide (PPS) Glass Filled | Square | 0.8 mm | 0.031 in | 2 | Right Angle Surface Mount | All | Board Guide Solder Retention | 500 mA | 16 | Male Pin | 85 °C | -40 C | Solder | Push-Pull | Black | Header | 0.059 in | 1.5 mm | 1.8 mm | 0.071 in | Tin | 0.185 in | 4.7 mm | Shrouded - 4 Wall | |||||
JAE Electronics | Copper Alloy | General Purpose | Polyphenylene Sulfide (PPS) Glass Filled | Square | 0.8 mm | 0.031 in | 2 | Surface Mount | All | 0.128 in | 3.25 mm | Board Guide Solder Retention | 0.5 A | 16 | Forked | 85 °C | -40 C | Solder | Push-Pull | Black | UL94 V-0 | Receptacle | 0.059 in | 1.5 mm | Gold | ||||||
JAE Electronics | Brass | Polyphenylene Sulfide (PPS) | Square | 0.8 mm | 0.031 in | 2 | Surface Mount | All | Board Guide Solder Retention | 500 mA | 16 | Male Pin | 85 °C | -40 C | Solder | Push-Pull | Black | Header | 0.059 in | 1.5 mm | 1.8 mm | 0.071 in | Tin | 0.144 " | 3.66 mm | Shrouded - 4 Wall | |||||
JAE Electronics | Copper Alloy | General Purpose | Polyphenylene Sulfide (PPS) Glass Filled | Square | 0.8 mm | 0.031 in | 2 | Surface Mount | All | 0.128 in | 3.25 mm | Board Guide Solder Retention | 0.5 A | 16 | Forked | 85 °C | -40 C | Solder | Push-Pull | Black | UL94 V-0 | Receptacle | 0.059 in | 1.5 mm | |||||||
JAE Electronics | Brass | Polyphenylene Sulfide (PPS) | Square | 0.8 mm | 0.031 in | 2 | Surface Mount | All | Board Guide Solder Retention | 500 mA | 16 | Male Pin | 85 °C | -40 C | Solder | Push-Pull | Black | Header | 0.059 in | 1.5 mm | 1.8 mm | 0.071 in | Tin | 0.144 " | 3.66 mm | Shrouded - 4 Wall |