054809 Series
Manufacturer: Molex
0548092575
| Part | Current Rating (Amps) | Mounting Type | Actuator Material | Height Above Board | Height Above Board [z] | Mating Cycles | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Locking Feature | Voltage Rating | Cable End Type | FFC, FCB Thickness | Connector/Contact Type | Contact Material | Flat Flex Type | Housing Material | Pitch [x] | Pitch [x] | Material Flammability Rating | Contact Finish | Number of Positions | Features | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | 200 mA | Surface Mount Right Angle | Nylon 4/6 Polyamide (PA46) | 1.3 mm | 0.051 " | 20 | Solder | 85 °C | -20 C | Flip Lock | 50 V | Tapered | 0.2 mm | Contacts Bottom | Phosphor Bronze | FPC | Liquid Crystal Polymer (LCP) | 0.012 in | 0.3 mm | UL94 V-0 | Gold | ||||
Molex | 300 mA | Surface Mount Right Angle | Nylon 4/6 Polyamide (PA46) | 1.3 mm | 0.051 " | 20 | Solder | 85 °C | -20 C | Flip Lock | 50 V | Tapered | 0.2 mm | Contacts Bottom | Phosphor Bronze | FPC | Liquid Crystal Polymer (LCP) | 0.012 in | 0.3 mm | UL94 V-0 | Tin Bismuth | 39 | Solder Retention Zero Insertion Force (ZIF) | ||
Molex | 300 mA | Surface Mount Right Angle | Nylon 4/6 Polyamide (PA46) | 1.3 mm | 0.051 " | 20 | Solder | 85 °C | -20 C | Flip Lock | 50 V | Tapered | 0.2 mm | Contacts Bottom | Phosphor Bronze | FPC | Liquid Crystal Polymer (LCP) | 0.012 in | 0.3 mm | UL94 V-0 | Tin Bismuth | 11 | Solder Retention Zero Insertion Force (ZIF) | ||
Molex | 300 mA | Surface Mount Right Angle | Nylon 4/6 Polyamide (PA46) | 1.3 mm | 0.051 " | 20 | Solder | 85 °C | -20 C | Flip Lock | 50 V | Tapered | 0.2 mm | Contacts Bottom | Phosphor Bronze | FPC | Liquid Crystal Polymer (LCP) | 0.012 in | 0.3 mm | UL94 V-0 | Tin Bismuth | 33 | Solder Retention Zero Insertion Force (ZIF) | ||
Molex | 300 mA | Surface Mount Right Angle | Nylon 4/6 Polyamide (PA46) | 1.3 mm | 0.051 " | 20 | Solder | 85 °C | -20 C | Flip Lock | 50 V | Tapered | 0.2 mm | Contacts Bottom | Phosphor Bronze | FPC | Liquid Crystal Polymer (LCP) | 0.012 in | 0.3 mm | UL94 V-0 | Tin Bismuth | 27 | Solder Retention Zero Insertion Force (ZIF) | ||
Molex | 300 mA | Surface Mount Right Angle | Nylon 4/6 Polyamide (PA46) | 1.3 mm | 0.051 " | 20 | Solder | 85 °C | -20 C | Flip Lock | 50 V | Tapered | 0.2 mm | Contacts Bottom | Phosphor Bronze | FPC | Liquid Crystal Polymer (LCP) | 0.012 in | 0.3 mm | UL94 V-0 | Tin Bismuth | 31 | Solder Retention Zero Insertion Force (ZIF) | ||
Molex | 300 mA | Surface Mount Right Angle | Nylon 4/6 Polyamide (PA46) | 1.3 mm | 0.051 " | 20 | Solder | 85 °C | -20 C | Flip Lock | 50 V | Tapered | 0.2 mm | Contacts Bottom | Phosphor Bronze | FPC | Liquid Crystal Polymer (LCP) | 0.012 in | 0.3 mm | UL94 V-0 | Tin Bismuth | 21 | Solder Retention Zero Insertion Force (ZIF) | ||
Molex | 0.2 A | Surface Mount Right Angle | Nylon 4/6 Polyamide (PA46) | 1.3 mm | 0.051 " | 20 | Solder | 85 °C | -20 C | Flip Lock | 50 V | Tapered | 0.2 mm | Contacts Bottom | Phosphor Bronze | FPC | Liquid Crystal Polymer (LCP) | 0.012 in | 0.3 mm | UL94 V-0 | Gold | 21 | Solder Retention Zero Insertion Force (ZIF) | 8 çin | 0.203 çm |