LPC55S26 Series
Manufacturer: Freescale Semiconductor - NXP
IC MCU 32BIT 256KB FLSH 100LQFP
| Part | Peripherals | Number of I/O | Program Memory Type | Supplier Device Package | Package / Case | Oscillator Type | Operating Temperature [Max] | Operating Temperature [Min] | Core Processor | Speed | Data Converters [custom] | Data Converters [custom] | Program Memory Size | Mounting Type | Connectivity | Core Size | RAM Size | Voltage - Supply (Vcc/Vdd) [Min] | Voltage - Supply (Vcc/Vdd) [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Freescale Semiconductor - NXP | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | 64 | FLASH | 100-HLQFP (14x14) | 100-LQFP Exposed Pad | External Internal | 105 °C | -40 °C | ARM® Cortex®-M33 | 150 MHz | 10 channels | 16 | 256 KB | Surface Mount | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 32-Bit Single-Core | 144 K | 1.8 V | 3.6 V |
Freescale Semiconductor - NXP | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | 36 | FLASH | 64-HTQFP (10x10) | 64-TQFP Exposed Pad | External Internal | 105 °C | -40 °C | ARM® Cortex®-M33 | 150 MHz | 10 channels | 16 | 256 KB | Surface Mount | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 32-Bit Single-Core | 144 K | 1.8 V | 3.6 V |
Freescale Semiconductor - NXP | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | 64 | FLASH | 98-VFBGA (7x7) | 98-VFBGA | External Internal | 105 °C | -40 °C | ARM® Cortex®-M33 | 150 MHz | 10 channels | 16 | 256 KB | Surface Mount | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 32-Bit Single-Core | 144 K | 1.8 V | 3.6 V |
Freescale Semiconductor - NXP | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | 64 | FLASH | 100-HLQFP (14x14) | 100-LQFP Exposed Pad | External Internal | 105 °C | -40 °C | ARM® Cortex®-M33 | 150 MHz | 10 channels | 16 | 256 KB | Surface Mount | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 32-Bit Single-Core | 144 K | 1.8 V | 3.6 V |
Freescale Semiconductor - NXP | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | 64 | FLASH | 100-HLQFP (14x14) | 100-LQFP Exposed Pad | External Internal | 105 °C | -40 °C | ARM® Cortex®-M33 | 150 MHz | 10 channels | 16 | 256 KB | Surface Mount | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 32-Bit Single-Core | 144 K | 1.8 V | 3.6 V |
Freescale Semiconductor - NXP | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | 36 | FLASH | 64-HTQFP (10x10) | 64-TQFP Exposed Pad | External Internal | 105 °C | -40 °C | ARM® Cortex®-M33 | 150 MHz | 10 channels | 16 | 256 KB | Surface Mount | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 32-Bit Single-Core | 144 K | 1.8 V | 3.6 V |
Freescale Semiconductor - NXP | Brown-out Detect/Reset DMA I2S POR PWM RNG WDT | 64 | FLASH | 98-VFBGA (7x7) | 98-VFBGA | External Internal | 105 °C | -40 °C | ARM® Cortex®-M33 | 150 MHz | 10 channels | 16 | 256 KB | Surface Mount | Flexcomm I2C MMC/SD/SDIO SPI UART/USART USB | 32-Bit Single-Core | 144 K | 1.8 V | 3.6 V |