FI-JH30 Series
Manufacturer: JAE Electronics
Beta
⌘K
CONN RCPT 30P 0.016 GOLD SMD R/A
| Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Material | Contact Material | Features | Number of Positions | Style | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Insulation Height [z] | Insulation Height [z] | Connector Type | Number of Rows | Number of Positions Loaded | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Fastening Type | Termination | Contact Finish - Mating | Contact Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 JAE Electronics | 1.25 µin | 0.032 µm | Plastic | Copper Alloy | Solder Retention | 30 | Board to Cable/Wire | Gold | 0.4 mm | 0.016 in | 1 mm | 0.039 in | Receptacle | 1 | All | 3.9 µin | 0.099 µm | Right Angle Surface Mount | Friction Lock | Solder | Gold | Non-Gendered |