LM49251 Series

1.37-W, stereo analog input Class-AB audio amplifier with 20-mW headphone amplifier

Catalog

1.37-W, stereo analog input Class-AB audio amplifier with 20-mW headphone amplifier

Part	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case	Features	Type	Voltage - Supply [Min]	Voltage - Supply [Max]	Supplier Device Package [x]	Supplier Device Package [y]	Supplier Device Package	Mounting Type	Max Output Power x Channels @ Load	Output Type
Texas Instruments LM49251TL/NOPB	85 °C	-40 °C	30-WFBGA	Depop I2C Shutdown Volume Control	Class D Class G	2.7 V	5.5 V	2.56	3.02	30-µSMD	Surface Mount	1.37 W 20 mW	2-Channel (Stereo) with Stereo Headphones
Texas Instruments LM49251TLX/NOPB	85 °C	-40 °C	30-WFBGA DSBGA	Depop I2C Shutdown Volume Control	Class D Class G	2.7 V	5.5 V			30-DSBGA	Surface Mount	1.37 W 20 mW	2-Channel (Stereo) with Stereo Headphones

Catalog

1.37-W, stereo analog input Class-AB audio amplifier with 20-mW headphone amplifier

Key Features

• Class G Ground Referenced Headphone OutputsE2S Class D AmplifierNo Clip FunctionPower Limiter Speaker ProtectionI2C Volume and Mode ControlAdvanced Click-and-Pop SuppressionMicro-Power ShutdownKey SpecificationsClass G Headphone Amplifier, HPVDD= 1.8V, RL= 32ΩIDDQHP: 1.15 mA (Typ)Output Power, THD+N ≤ 1%: 20 mW (Typ)Stereo Class D Speaker Amplifier RL= 8ΩOutput Power, THD+N ≤ 1%, LSVDD= 5.0V: 1.37 W (Typ)Output Power, THD+N ≤ 1%, LSVDD= 3.6V: 680 mW (Typ)Efficiency: 90% (Typ)All trademarks are the property of their respective owners.Class G Ground Referenced Headphone OutputsE2S Class D AmplifierNo Clip FunctionPower Limiter Speaker ProtectionI2C Volume and Mode ControlAdvanced Click-and-Pop SuppressionMicro-Power ShutdownKey SpecificationsClass G Headphone Amplifier, HPVDD= 1.8V, RL= 32ΩIDDQHP: 1.15 mA (Typ)Output Power, THD+N ≤ 1%: 20 mW (Typ)Stereo Class D Speaker Amplifier RL= 8ΩOutput Power, THD+N ≤ 1%, LSVDD= 5.0V: 1.37 W (Typ)Output Power, THD+N ≤ 1%, LSVDD= 3.6V: 680 mW (Typ)Efficiency: 90% (Typ)All trademarks are the property of their respective owners.

Description

The LM49251 is a fully integrated audio subsystem designed for portable handheld applications such as cellular phones. Part of TI’s PowerWise family of products, the LM49251 utilizes a high efficiency class G headphone amplifier topology as well as a high efficiency class D loudspeaker. The headphone amplifiers feature TI’s class G ground referenced architecture that creates a ground-referenced output with dynamic supply rails for optimum efficiency. The stereo class D speaker amplifier provides both a no-clip feature and speaker protection. The Enhanced Emission Suppression (E2S) outputs feature a patented, ultra low EMI PWM architecture that significantly reduces RF emissions. The LM49251 features separate volume controls for the mono and stereo inputs. Mode selection, shutdown control, and volume are controlled through an I2C compatible interface. Click and pop suppression eliminates audible transients on power-up/down and during shutdown. The LM49251 is available in an ultra-small 30-bump DSBGA package (2.55mmx3.02mm) The LM49251 is a fully integrated audio subsystem designed for portable handheld applications such as cellular phones. Part of TI’s PowerWise family of products, the LM49251 utilizes a high efficiency class G headphone amplifier topology as well as a high efficiency class D loudspeaker. The headphone amplifiers feature TI’s class G ground referenced architecture that creates a ground-referenced output with dynamic supply rails for optimum efficiency. The stereo class D speaker amplifier provides both a no-clip feature and speaker protection. The Enhanced Emission Suppression (E2S) outputs feature a patented, ultra low EMI PWM architecture that significantly reduces RF emissions. The LM49251 features separate volume controls for the mono and stereo inputs. Mode selection, shutdown control, and volume are controlled through an I2C compatible interface. Click and pop suppression eliminates audible transients on power-up/down and during shutdown. The LM49251 is available in an ultra-small 30-bump DSBGA package (2.55mmx3.02mm)