MOC216M Series

8-pin SOIC Single-Channel Phototransistor Output Optocoupler

Catalog

8-pin SOIC Single-Channel Phototransistor Output Optocoupler

Part	Voltage - Forward (Vf) (Typ)	Input Type	Voltage - Isolation	Operating Temperature [Max]	Operating Temperature [Min]	Rise / Fall Time (Typ) [custom]	Rise / Fall Time (Typ) [custom]	Current - DC Forward (If) (Max) [Max]	Voltage - Output (Max) [Max]	Mounting Type	Vce Saturation (Max) [Max]	Current - Output / Channel	Number of Channels	Current Transfer Ratio (Min) [Min]	Supplier Device Package	Package / Case	Package / Case [y]	Package / Case [x]	Turn On / Turn Off Time (Typ)
ON Semiconductor MOC216R2VM	1.07 V	DC	2500 Vrms	100 °C	-40 °C	3.2 µs	4.7 µs	60 mA	30 V	Surface Mount	400 mV	150 mA	1	50 %	8-SOIC	8-SOIC	3.9 mm	0.154 in	5.7 µs 7.5 µs
ON Semiconductor MOC216R1VM	1.07 V	DC	2500 Vrms	100 °C	-40 °C	3.2 µs	4.7 µs	60 mA	30 V	Surface Mount	400 mV	150 mA	1	50 %	8-SOIC	8-SOIC	3.9 mm	0.154 in	5.7 µs 7.5 µs
ON Semiconductor MOC216R2M	1.07 V	DC	2500 Vrms	100 °C	-40 °C	3.2 µs	4.7 µs	60 mA	30 V	Surface Mount	400 mV	150 mA	1	50 %	8-SOIC	8-SOIC	3.9 mm	0.154 in	5.7 µs 7.5 µs
ON Semiconductor MOC216R2VM	1.07 V	DC	2500 Vrms	100 °C	-40 °C	3.2 µs	4.7 µs	60 mA	30 V	Surface Mount	400 mV	150 mA	1	50 %	8-SOIC	8-SOIC	3.9 mm	0.154 in	5.7 µs 7.5 µs

Catalog

8-pin SOIC Single-Channel Phototransistor Output Optocoupler

Key Features

• "Closely Matched Current Transfer Ratios

• Minimum BVCEOof 70 V Guaranteed

• MOC205M, MOC206M, MOC207M

• Minimum BVCEOof 30 V Guaranteed

• MOC211M, MOC212M, MOC213M, MOC216M,MOC217M

• Low LED Input Current Required for Easier Logic Interfacing

• MOC216M, MOC217M

• Convenient Plastic SOIC-8 Surface Mountable Package Style, with 0.050" Lead Spacing

• Safety and Regulatory Approvals:

• UL1577, 2,500 VACRMSfor 1 Minute

• DIN-EN/IEC60747-5-5, 565 V Peak Working Insulation Voltage"

Description

These devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector, in a surface mountable, small outline, plastic package. They are ideally suited for high-density applications, and eliminate the need for through-the-board mounting.