892-108 Series
Manufacturer: EDAC Inc.
CONN EDGE DUAL FML 108POS 0.100
| Part | Card Type | Read Out | Termination | Contact Type | Number of Positions/Bay/Row | Contact Finish Thickness | Contact Finish Thickness | Contact Finish | Gender | Material - Insulation | Mounting Type | Card Thickness [Max] | Card Thickness [Min] | Number of Positions | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material | Number of Rows [custom] | Termination Rows [custom] | Color | Pitch | Pitch | Features | Flange Feature | Flange Feature [diameter] | Flange Feature [diameter] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
EDAC Inc. | Non Specified - Dual Edge | Dual | Solder Eyelet(s) | Cantilever | 54 | 0.25 Ám | 10 Áin | Gold | Female | Polyphenylene Sulfide (PPS) | Through Hole | 0.07 in 1.78 mm | 0.054 in 1.37 mm | 108 | 125 °C | -40 C | Copper Alloy | 2 | 2 | Black | 0.1 " | 2.54 mm | ||||
EDAC Inc. | Non Specified - Dual Edge | Dual | Solder | Cantilever | 54 | 0.25 Ám | 10 Áin | Gold | Female | Polyphenylene Sulfide (PPS) | Board Edge Straddle Mount | 0.07 in 1.78 mm | 0.054 in 1.37 mm | 108 | 125 °C | -40 C | Copper Alloy | 2 | 2 | Black | 0.1 " | 2.54 mm | Card Extender | |||
EDAC Inc. | Non Specified - Dual Edge | Dual | Solder | Cantilever | 54 | 0.25 Ám | 10 Áin | Gold | Female | Polyphenylene Sulfide (PPS) | Through Hole | 0.07 in 1.78 mm | 0.054 in 1.37 mm | 108 | 125 °C | -40 C | Copper Alloy | 2 | 2 | Black | 0.1 " | 2.54 mm | Flush Mount Top Opening Unthreaded | 3.25 mm | 0.128 " | |
EDAC Inc. | Non Specified - Dual Edge | Dual | Solder | Cantilever | 54 | 0.25 Ám | 10 Áin | Gold | Female | Polyphenylene Sulfide (PPS) | Through Hole | 0.07 in 1.78 mm | 0.054 in 1.37 mm | 108 | 125 °C | -40 C | Copper Alloy | 2 | 2 | Black | 0.1 " | 2.54 mm | Floating Bobbin Flush Mount | 2.95 mm | 0.116 " | |
EDAC Inc. | Non Specified - Dual Edge | Dual | Wire Wrap | Cantilever | 54 | 0.25 Ám | 10 Áin | Gold | Female | Polyphenylene Sulfide (PPS) | Through Hole | 0.07 in 1.78 mm | 0.054 in 1.37 mm | 108 | 125 °C | -40 C | Copper Alloy | 2 | 2 | Black | 0.1 " | 2.54 mm | Floating Bobbin Flush Mount | 2.95 mm | 0.116 " | |
EDAC Inc. | Non Specified - Dual Edge | Dual | Wire Wrap | Cantilever | 54 | 0.25 Ám | 10 Áin | Gold | Female | Polyphenylene Sulfide (PPS) | Through Hole | 0.07 in 1.78 mm | 0.054 in 1.37 mm | 108 | 125 °C | -40 C | Copper Alloy | 2 | 2 | Black | 0.1 " | 2.54 mm | ||||
EDAC Inc. | Non Specified - Dual Edge | Dual | Wire Wrap | Cantilever | 54 | 0.25 Ám | 10 Áin | Gold | Female | Polyphenylene Sulfide (PPS) | Through Hole | 0.07 in 1.78 mm | 0.054 in 1.37 mm | 108 | 125 °C | -40 C | Copper Alloy | 2 | 2 | Black | 0.1 " | 2.54 mm | Flush Mount Top Opening Unthreaded | 3.25 mm | 0.128 " | |
EDAC Inc. | Non Specified - Dual Edge | Dual | Solder | Cantilever | 54 | 0.25 Ám | 10 Áin | Gold | Female | Polyphenylene Sulfide (PPS) | Board Edge Straddle Mount | 0.07 in 1.78 mm | 0.054 in 1.37 mm | 108 | 125 °C | -40 C | Copper Alloy | 2 | 2 | Black | 0.1 " | 2.54 mm | Card Extender | |||
EDAC Inc. | Non Specified - Dual Edge | Dual | Solder | Cantilever | 54 | 0.25 Ám | 10 Áin | Gold | Female | Polyphenylene Sulfide (PPS) | Right Angle Through Hole | 0.07 in 1.78 mm | 0.054 in 1.37 mm | 108 | 125 °C | -40 C | Copper Alloy | 2 | 2 | Black | 0.1 " | 2.54 mm | Flush Mount Top Opening Unthreaded | 3.96 mm | 0.156 " | |
EDAC Inc. | Non Specified - Dual Edge | Dual | Solder | Cantilever | 54 | 0.25 Ám | 10 Áin | Gold | Female | Polyphenylene Sulfide (PPS) | Board Edge Straddle Mount | 0.07 in 1.78 mm | 0.054 in 1.37 mm | 108 | 125 °C | -40 C | Copper Alloy | 2 | 2 | Black | 0.1 " | 2.54 mm | Card Extender | Flush Mount Top Opening Unthreaded | 3.25 mm | 0.128 " |