Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Surface Mount, 7 Circuits, Tin-Bismuth Plating, Natural
Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Surface Mount, 7 Circuits, Tin-Bismuth Plating, Natural
Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Surface Mount, 7 Circuits, Tin-Bismuth Plating, Natural
| Part | Number of Positions | Contact Shape | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Fastening Type | Insulation Material | Number of Rows | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Applications | Mounting Type | Style | Contact Finish - Mating | Current Rating (Amps) | Pitch - Mating [x] | Pitch - Mating [x] | Contact Finish - Post | Termination | Material Flammability Rating | Connector Type | Contact Type | Contact Material | Voltage Rating | Insulation Color | Features | Number of Positions Loaded | Insulation Height | Insulation Height | Shrouding |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Molex | 4 | Square | 1 µm | 39.4 µin | -40 °C | 105 ░C | Latch Lock | Nylon Polyamide (PA) | 1 | 1 çm | 39.4 çin | General Purpose Industrial | Surface Mount Right Angle | Board to Cable/Wire | Tin-Bismuth | 4 A | 0.079 in | 2 mm | Tin-Bismuth | Solder | UL94 V-0 | Header | Male Pin | Brass | 250 VAC | Black | Solder Retention | All | 0.283 " | 7.19 mm | Shrouded - 4 Wall |
 Molex | Square | 1 µm | 39.4 µin | -40 °C | 105 ░C | Latch Lock | Nylon Polyamide (PA) | 1 | 1 çm | 39.4 çin | General Purpose Industrial | Surface Mount Right Angle | Board to Cable/Wire | Tin-Bismuth | 4 A | 0.079 in | 2 mm | Tin-Bismuth | Solder | UL94 V-0 | Header | Male Pin | Brass | 250 VAC | Black | Solder Retention | All | 0.283 " | 7.19 mm | Shrouded - 4 Wall |