501044 Series
Manufacturer: Molex
CONN WIRE TO BOARD RCP 40 POS 0.4MM SOLDER RA SMD T/R
| Part | Contact Material | Insulation Material | Contact Finish Thickness - Post [custom] | Contact Finish Thickness - Post [custom] | Applications | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Operating Temperature [Max] | Operating Temperature [Min] | Style | Connector Type | Contact Finish - Mating | Contact Type | Insulation Height | Insulation Height | Number of Rows | Material Flammability Rating | Number of Positions | Termination | Mounting Type | Number of Positions Loaded | Current Rating (Amps) | Features | Fastening Type | Insulation Color | Pitch - Mating | Pitch - Mating | Voltage Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | Copper Alloy | Glass Filled Plastic | 0.41 µm | 16 µin | General Purpose Medical | 8 µin | 0.203 µm | Gold | 75 ░C | -30 ░C | Board to Cable/Wire | Receptacle | Gold | Center Strip Contact | 0.045 in | 1.15 mm | 1 | UL94 V-0 | 40 | Solder | Right Angle Surface Mount | All | 200 mA | Shielded Solder Retention | Detent Lock | Black | 0.4 mm | 0.016 in | 30 VDC |
Molex | Copper Alloy | Glass Filled Plastic | 0.41 µm | 16 µin | General Purpose Medical | 8 µin | 0.203 µm | Gold | 75 ░C | -30 ░C | Board to Cable/Wire | Receptacle | Gold | Center Strip Contact | 0.045 in | 1.15 mm | 1 | UL94 V-0 | 30 | Solder | Right Angle Surface Mount | All | 200 mA | Shielded Solder Retention | Detent Lock | Black | 0.4 mm | 0.016 in | 30 VDC |