BDN18 Series
Manufacturer: CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.81"SQ
| Part | Shelf Life | Type | Length | Length | Material | Shape | Width | Width | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Attachment Method | Fin Height | Fin Height | Material Finish | Fin Height [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products | 24 Months | Top Mount | 1.81 in | 45.97 mm | Aluminum | Pin Fins Square | 45.97 mm | 1.81 in | ASIC BGA CPU LGA | 2.8 °C/W | 8.1 °C/W | Thermal Tape Adhesive (Included) | 0.605 in | 15.37 mm | Black Anodized | |
CTS Thermal Management Products | 24 Months | Top Mount | 1.81 in | 45.97 mm | Aluminum | Pin Fins Square | 45.97 mm | 1.81 in | ASIC BGA CPU LGA | 3.5 °C/W | 10.8 °C/W | Thermal Tape Adhesive (Included) | 9.02 mm | Black Anodized | 0.355 in |