6030 Series
Manufacturer: Boyd Laconia, LLC
Beta
⌘K
BOARD LEVEL HEAT SINK
| Part | Thermal Resistance @ Natural | Attachment Method | Package Cooled | Shape [custom] | Shape [custom] | Thermal Resistance @ Forced Air Flow | Length | Length | Material Finish | Material | Fin Height | Fin Height | Power Dissipation @ Temperature Rise | Type | Width [x] | Width [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Boyd Laconia, LLC | 12.5 °C/W | Bolt On PC Pin | TO-220 | Rectangular | Fins | 6 °C/W | 29.97 mm | 1.18 in | Tin | Copper | 0.5 " | 12.7 mm | 1 W 20 °C | Board Level Vertical | 25.4 mm | 1 in |